LFE3-95EA-7FN672I
| Part Description |
ECP3 Field Programmable Gate Array (FPGA) IC 380 4526080 92000 672-BBGA |
|---|---|
| Quantity | 1,423 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 672-FPBGA (27x27) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 672-BBGA | Number of I/O | 380 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 11500 | Number of Logic Elements/Cells | 92000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 4526080 |
Overview of LFE3-95EA-7FN672I – ECP3 Field Programmable Gate Array (FPGA), 92,000 logic elements, 380 I/O, 672-BBGA
The LFE3-95EA-7FN672I is an ECP3 family Field Programmable Gate Array (FPGA) designed for industrial applications requiring high logic capacity, flexible I/O and embedded memory. It combines 92,000 logic elements with robust on-chip memory and programmable I/O to address high-speed communications, signal processing and embedded control designs.
This device delivers system-level integration through embedded SERDES, DSP-optimized slices and comprehensive configuration support, enabling compact, power-conscious implementations in industrial and networking equipment.
Key Features
- Core Logic 92,000 logic elements provide substantial LUT capacity for complex digital logic and control functions.
- Embedded Memory Approximately 4.53 Mbits of on-chip RAM (4,526,080 bits) for frame buffering, packet queues and application data storage.
- High-Speed SERDES Embedded SERDES capability with data rates up to 3.2 Gbps for serial protocols; family architecture supports multiple high-speed channels for interfaces such as PCI Express, Ethernet and SONET/SDH.
- sysDSP Slices Dedicated DSP resources in the ECP3 family provide high-performance multiply-accumulate operations for signal processing tasks (family-level feature).
- Programmable sysI/O Support for a wide range of I/O standards and pre-engineered source-synchronous interfaces, with DDR registers in I/O cells and dedicated read/write leveling and gearing logic (family-level features).
- Clocking and Timing Device family supports multiple PLLs and DLLs for flexible clock generation and deterministic timing (family-level capability).
- Package & Mounting 672-BBGA package (supplier 672-FPBGA 27 × 27 mm), surface-mount mounting type, and 380 user I/Os for high pin-count board integration.
- Power Core voltage supply range of 1.14 V to 1.26 V for the device core.
- Operating Range & Compliance Industrial temperature grade with operating range from −40 °C to 100 °C; RoHS compliant for environmental standards.
- System-Level Support Family-level features include IEEE 1149.1 and IEEE 1532 support, on-chip oscillator, dual-boot/configuration options and debug/configuration utilities.
Typical Applications
- High‑Speed Communications Implement multi‑protocol serial links (PCIe, Ethernet, SONET/SDH) using embedded SERDES and abundant I/O for line cards and network interfaces.
- Signal Processing & DSP Use dedicated sysDSP slices and embedded memory for real‑time filtering, codec acceleration and multi‑channel signal processing.
- Video & Broadcast Support broadcast standards and high‑bandwidth video transport (SMPTE/3G and similar protocols) with SERDES and large on‑chip buffers.
- Industrial Control & Instrumentation Apply the device’s industrial temperature rating, flexible I/O and deterministic clocking to motor control, sensor aggregation and deterministic control systems.
Unique Advantages
- High logic capacity: 92,000 logic elements enable integration of multiple system functions into a single device, reducing external glue logic and BOM complexity.
- Substantial on‑chip memory: Approximately 4.53 Mbits of embedded RAM for local buffering and state storage, minimizing external memory bandwidth needs.
- High‑speed serial support: Embedded SERDES with up to 3.2 Gbps capability facilitates modern serial protocols and scalable channel counts.
- Flexible I/O and package density: 380 user I/Os in a 672‑ball BGA footprint provide a high pin count for mixed I/O, memory interfaces and peripheral connections.
- Industrial operating range: −40 °C to 100 °C rating supports deployment in industrial environments requiring extended temperature tolerance.
- Comprehensive system features: On‑chip oscillators, boot options, and family support for JTAG and configuration/diagnostic standards simplify development and in‑field updates.
Why Choose LFE3-95EA-7FN672I?
The LFE3-95EA-7FN672I sits in the Lattice ECP3 family to deliver a balanced combination of dense logic, meaningful embedded memory and high-speed serial capability in a single industrial-grade FPGA. Its mix of resources makes it suitable for designers targeting networking, industrial control, video and DSP-enabled systems that benefit from integration and compact board-level implementation.
Backed by ECP3 family system-level features—programmable I/O, clocking resources and configuration flexibility—this device supports scalable designs where long-term robustness, ecosystem tools and field configurability are important considerations.
Request a quote or submit a sales inquiry to receive pricing, availability and delivery details for the LFE3-95EA-7FN672I FPGA.

Date Founded: 1983
Headquarters: Hillsboro, Oregon, USA
Employees: 1,000+
Revenue: $627.7 Million
Certifications and Memberships: ISO9001:2015, ISO14001:2015, IATF16949:2016