LFE3-95EA-7LFN484C
| Part Description |
ECP3 Field Programmable Gate Array (FPGA) IC 295 4526080 92000 484-BBGA |
|---|---|
| Quantity | 253 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA | Number of I/O | 295 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 11500 | Number of Logic Elements/Cells | 92000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 4526080 |
Overview of LFE3-95EA-7LFN484C – ECP3 Field Programmable Gate Array (FPGA), 92,000 LEs, 295 I/Os
The LFE3-95EA-7LFN484C is an ECP3 family Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation built for commercial embedded applications. It integrates a high logic density core with substantial on-chip memory and a large I/O count, enabling complex programmable logic and interfacing in a compact surface-mount package.
Key on-device resources include 92,000 logic elements, approximately 4.53 Mbits of embedded memory, and 295 I/Os. The device operates from a 1.14 V to 1.26 V supply and is specified for commercial temperature operation from 0 °C to 85 °C.
Key Features
- Core and Logic ECP3 family FPGA architecture with 92,000 logic elements to implement complex programmable logic functions.
- Embedded Memory Approximately 4.53 Mbits of on-chip RAM to support buffering, state storage, and memory-mapped logic structures.
- I/O and Connectivity 295 available I/Os to support a wide range of peripheral interfaces and high-density signal routing.
- Power Low-voltage core operation with a specified supply range of 1.14 V to 1.26 V for the device core.
- Package and Mounting 484-ball BGA (484-BBGA / 484-FPBGA, 23×23) in a surface-mount form factor for compact board integration.
- Temperature and Grade Commercial-grade device rated for operation from 0 °C to 85 °C.
- Environmental Compliance RoHS-compliant construction for regulatory and manufacturing compatibility.
Typical Applications
- Commercial Embedded Systems Programmable logic integration for control, glue logic, and protocol handling in commercial devices operating within 0 °C to 85 °C.
- High-Density I/O Interfaces Front-end or protocol translation roles where a high pin count and flexible I/O are needed.
- Data Buffering and Processing On-chip memory and abundant logic elements to implement buffering, packet handling, and custom data paths.
Unique Advantages
- High Logic Density: 92,000 logic elements provide capacity for complex designs while consolidating functions into a single FPGA.
- Substantial Embedded Memory: Approximately 4.53 Mbits of on-chip RAM reduces dependence on external memory for many buffering and state-storage tasks.
- Large I/O Count: 295 I/Os support multiple parallel interfaces and high-pin-count designs without extensive external multiplexing.
- Compact BGA Package: 484-ball BGA (23×23) enables a small PCB footprint for high-density boards and surface-mount assembly.
- Commercial Temperature Rating: Rated for 0 °C to 85 °C operation to match typical commercial embedded product environments.
- Regulatory Compatibility: RoHS compliance supports environmentally conscious manufacturing and supply-chain requirements.
Why Choose LFE3-95EA-7LFN484C?
The LFE3-95EA-7LFN484C balances high logic and memory capacity with a large I/O count in a compact surface-mount BGA package, making it well suited for commercial embedded designs that require substantial programmable logic and interfacing capability. Its low-voltage core and RoHS-compliant construction support modern board-level power architectures and manufacturing requirements.
This FPGA is appropriate for engineers and procurement teams seeking a programmable solution from Lattice Semiconductor Corporation that offers a combination of integration, connectivity, and commercial-temperature operation for medium- to high-complexity designs.
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