LFE3-95E-7FN1156I

IC FPGA 490 I/O 1156FBGA
Part Description

ECP3 Field Programmable Gate Array (FPGA) IC 490 4526080 92000 1156-BBGA

Quantity 518 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1156-FPBGA (35x35)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1156-BBGANumber of I/O490Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs11500Number of Logic Elements/Cells92000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits4526080

Overview of LFE3-95E-7FN1156I – ECP3 Field Programmable Gate Array, 1156-BBGA

The LFE3-95E-7FN1156I from Lattice Semiconductor Corporation is an industrial-grade member of the LatticeECP3 family of FPGAs. It delivers a high-density reconfigurable fabric with 92,000 logic elements and approximately 4.53 Mbits of embedded memory, packaged in a 1156-ball FBGA (35 × 35 mm) for high I/O count designs.

Designed for applications that require large logic capacity, substantial on-chip RAM and extensive I/O, this device supports robust system-level features from the ECP3 family such as enhanced DSP resources, flexible I/O standards and on-chip clocking and configuration options. The combination of logic density, memory and 490 user I/Os makes it suited to demanding industrial and communications designs.

Key Features

  • Logic Capacity — 92,000 logic elements to implement complex control, signal processing and protocol logic.
  • Embedded Memory — Total on-chip RAM of 4,526,080 bits (approximately 4.53 Mbits) for buffer and state storage.
  • I/O Density — 490 user I/Os in a high-pin-count package to support wide parallel interfaces and multiple peripherals.
  • Industrial Temperature Range — Rated for operation from −40 °C to 100 °C for use in industrial environments.
  • Power Supply — Core voltage supply range 1.14 V to 1.26 V for defined power planning and regulator selection.
  • Package & Mounting — 1156-ball FBGA (35 × 35 mm) supplier device package; surface-mount for board-level assembly.
  • Family-Level DSP & IO Features — As part of the LatticeECP3 family, the device benefits from enhanced sysDSP slice architecture, on-chip PLLs/DLLs and flexible programmable I/O supporting a wide range of standards.
  • Configuration & System Support — Family features include SPI boot flash interface, dual-boot image capability, on-chip oscillator and configuration utilities (as provided by the LatticeECP3 family).
  • Environmental Compliance — RoHS compliant.

Typical Applications

  • Networking & Communications — Implement packet processing, protocol bridging and I/O aggregation where large logic capacity and many I/Os are required.
  • Video & Broadcast Processing — Use embedded memory and DSP resources for buffering, format conversion and timing-critical signal paths.
  • Industrial Control — Drive complex control logic, sensor interfacing and high-pin-count connectivity within an industrial temperature envelope.
  • High-Density Embedded Systems — Serve as the central programmable fabric in systems needing a mix of logic, memory and extensive external device interfaces.

Unique Advantages

  • High Logic Integration: 92,000 logic elements enable consolidation of multiple functions into a single FPGA, reducing board-level complexity.
  • Substantial On-Chip RAM: Approximately 4.53 Mbits of embedded memory supports large buffering and state machines without immediate external memory dependence.
  • Extensive I/O Count: 490 user I/Os in a 1156-ball FBGA provide flexible connectivity for parallel buses, peripherals and high-pin-count interfaces.
  • Industrial Reliability: Operation from −40 °C to 100 °C and surface-mount packaging align with industrial deployment and assembly processes.
  • Family Ecosystem: Access to LatticeECP3 family features—such as sysDSP slices, PLL/DLL clocking and flexible configuration options—helps accelerate design integration.
  • Controlled Power Envelope: Defined core voltage range (1.14 V–1.26 V) simplifies power design and regulator selection for the FPGA core.

Why Choose LFE3-95E-7FN1156I?

The LFE3-95E-7FN1156I is positioned for designs that require a high-density FPGA with significant on-chip memory and a large number of user I/Os, delivered in an industrial-rated, high-pin-count FBGA package. Its inclusion in the LatticeECP3 family means designers can leverage family-level DSP, clocking and configuration capabilities while meeting the thermal and environmental demands of industrial applications.

This device is well suited to engineering teams building complex embedded systems, networking equipment, broadcast/video platforms or industrial controllers who need a scalable, high-capacity programmable fabric with proven family-level features and RoHS compliance.

Request a quote or submit an inquiry to purchase LFE3-95E-7FN1156I and get pricing and availability information tailored to your project needs.

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