LFE3-95E-6FN484I

IC FPGA 295 I/O 484FBGA
Part Description

ECP3 Field Programmable Gate Array (FPGA) IC 295 4526080 92000 484-BBGA

Quantity 778 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package484-FPBGA (23x23)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case484-BBGANumber of I/O295Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs11500Number of Logic Elements/Cells92000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits4526080

Overview of LFE3-95E-6FN484I – ECP3 Field Programmable Gate Array (FPGA) IC 295 4526080 92000 484-BBGA

The LFE3-95E-6FN484I is an industrial-grade ECP3 family FPGA from Lattice Semiconductor, delivered in a 484-ball BGA package. It combines a reconfigurable FPGA fabric with DSP-oriented resources and high-speed I/O capability aimed at high-performance embedded and communications-oriented designs.

With 92,000 logic elements, approximately 4.53 Mbits of embedded memory and 295 user I/Os, this device targets designs that require dense logic, significant on-chip RAM, and flexible interfacing while operating across a wide industrial temperature range.

Key Features

  • Logic Capacity — 92,000 logic elements to implement complex control, signal processing and glue-logic functions.
  • Embedded Memory — Total on-chip RAM of 4,526,080 bits (approximately 4.53 Mbits) for buffers, FIFOs and local data storage.
  • I/O Density — 295 user I/Os to support multiple parallel interfaces and mixed-signal connections.
  • High-speed Serial and Protocol Support — Family-level embedded SERDES and protocol support (examples include PCI Express, Ethernet variants, SONET/SDH, CPRI and Serial RapidIO) enable integration of serial links and high-throughput interfaces.
  • Enhanced DSP Architecture — sysDSP slice architecture and dedicated multiplier structures (family features) for efficient multiply-accumulate and signal-processing tasks.
  • Clocking and Timing — On-chip PLLs and DLLs available (family-level support) to implement flexible clocking and source-synchronous interfaces.
  • Package & Mounting — 484-ball BGA (484-FPBGA, 23×23 mm) surface-mount package for compact board-level integration.
  • Power — Core voltage supply range of 1.14 V to 1.26 V (1.2 V nominal) for low-voltage core operation.
  • Industrial Temperature Range — Specified to operate from -40 °C to 100 °C for demanding environments.
  • Standards & Compliance — RoHS compliant for environmental regulatory requirements.

Typical Applications

  • High-speed Communications — Implement protocol endpoints and serial link interfaces using on-chip SERDES and flexible I/O.
  • Packet and Network Processing — Use the device’s logic density and embedded memory for buffering, packet parsing and custom networking functions.
  • Video and Broadcast Systems — Leverage DSP and source-synchronous I/O support for video transport, timing-critical data paths and media interfaces.
  • Industrial Control and Automation — Deploy the industrial temperature-rated device for real-time control, protocol bridging and sensor/actuator interfaces.

Unique Advantages

  • Substantial Logic and Memory in a Compact Package: 92,000 logic elements and approximately 4.53 Mbits of embedded memory provide integration of complex functions while minimizing external components.
  • Extensive I/O Capability: 295 user I/Os enable dense, flexible board-level connectivity and multi-protocol interfacing without heavy external logic.
  • Industrial Thermal Range: Rated from -40 °C to 100 °C to support deployments in harsh or temperature-variable environments.
  • Low-Voltage Core: 1.14 V to 1.26 V supply supports modern low-power system designs and aligns with common core-voltage rails.
  • Field-Proven Family Features: ECP3 family-level capabilities such as sysDSP, PLL/DLL clocking and SERDES bring DSP and high-speed link support to system designs.
  • RoHS Compliant: Meets environmental compliance expectations for manufactured electronics.

Why Choose LFE3-95E-6FN484I?

The LFE3-95E-6FN484I positions itself as a high-capacity, industrial-grade FPGA option for engineers needing substantial logic density, embedded memory and broad I/O in a compact BGA package. Its combination of device-level resources and ECP3 family features makes it suited to communications, video, networking and industrial applications that require on-chip DSP, buffering and flexible serial/parallel interfaces.

Selecting this device supports designs that value scalability and integration: reduce external component count, simplify board routing with high I/O count, and deploy in temperature-challenging environments while benefiting from Lattice ECP3 family-level capabilities.

Request a quote or submit an inquiry to get pricing, lead time and availability for the LFE3-95E-6FN484I.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay
    Featured Products
    Latest News
    keyboard_arrow_up