LFE3-95E-6FN484I
| Part Description |
ECP3 Field Programmable Gate Array (FPGA) IC 295 4526080 92000 484-BBGA |
|---|---|
| Quantity | 778 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA | Number of I/O | 295 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 11500 | Number of Logic Elements/Cells | 92000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 4526080 |
Overview of LFE3-95E-6FN484I – ECP3 Field Programmable Gate Array (FPGA) IC 295 4526080 92000 484-BBGA
The LFE3-95E-6FN484I is an industrial-grade ECP3 family FPGA from Lattice Semiconductor, delivered in a 484-ball BGA package. It combines a reconfigurable FPGA fabric with DSP-oriented resources and high-speed I/O capability aimed at high-performance embedded and communications-oriented designs.
With 92,000 logic elements, approximately 4.53 Mbits of embedded memory and 295 user I/Os, this device targets designs that require dense logic, significant on-chip RAM, and flexible interfacing while operating across a wide industrial temperature range.
Key Features
- Logic Capacity — 92,000 logic elements to implement complex control, signal processing and glue-logic functions.
- Embedded Memory — Total on-chip RAM of 4,526,080 bits (approximately 4.53 Mbits) for buffers, FIFOs and local data storage.
- I/O Density — 295 user I/Os to support multiple parallel interfaces and mixed-signal connections.
- High-speed Serial and Protocol Support — Family-level embedded SERDES and protocol support (examples include PCI Express, Ethernet variants, SONET/SDH, CPRI and Serial RapidIO) enable integration of serial links and high-throughput interfaces.
- Enhanced DSP Architecture — sysDSP slice architecture and dedicated multiplier structures (family features) for efficient multiply-accumulate and signal-processing tasks.
- Clocking and Timing — On-chip PLLs and DLLs available (family-level support) to implement flexible clocking and source-synchronous interfaces.
- Package & Mounting — 484-ball BGA (484-FPBGA, 23×23 mm) surface-mount package for compact board-level integration.
- Power — Core voltage supply range of 1.14 V to 1.26 V (1.2 V nominal) for low-voltage core operation.
- Industrial Temperature Range — Specified to operate from -40 °C to 100 °C for demanding environments.
- Standards & Compliance — RoHS compliant for environmental regulatory requirements.
Typical Applications
- High-speed Communications — Implement protocol endpoints and serial link interfaces using on-chip SERDES and flexible I/O.
- Packet and Network Processing — Use the device’s logic density and embedded memory for buffering, packet parsing and custom networking functions.
- Video and Broadcast Systems — Leverage DSP and source-synchronous I/O support for video transport, timing-critical data paths and media interfaces.
- Industrial Control and Automation — Deploy the industrial temperature-rated device for real-time control, protocol bridging and sensor/actuator interfaces.
Unique Advantages
- Substantial Logic and Memory in a Compact Package: 92,000 logic elements and approximately 4.53 Mbits of embedded memory provide integration of complex functions while minimizing external components.
- Extensive I/O Capability: 295 user I/Os enable dense, flexible board-level connectivity and multi-protocol interfacing without heavy external logic.
- Industrial Thermal Range: Rated from -40 °C to 100 °C to support deployments in harsh or temperature-variable environments.
- Low-Voltage Core: 1.14 V to 1.26 V supply supports modern low-power system designs and aligns with common core-voltage rails.
- Field-Proven Family Features: ECP3 family-level capabilities such as sysDSP, PLL/DLL clocking and SERDES bring DSP and high-speed link support to system designs.
- RoHS Compliant: Meets environmental compliance expectations for manufactured electronics.
Why Choose LFE3-95E-6FN484I?
The LFE3-95E-6FN484I positions itself as a high-capacity, industrial-grade FPGA option for engineers needing substantial logic density, embedded memory and broad I/O in a compact BGA package. Its combination of device-level resources and ECP3 family features makes it suited to communications, video, networking and industrial applications that require on-chip DSP, buffering and flexible serial/parallel interfaces.
Selecting this device supports designs that value scalability and integration: reduce external component count, simplify board routing with high I/O count, and deploy in temperature-challenging environments while benefiting from Lattice ECP3 family-level capabilities.
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