LFE3-95E-6FN484C

The LFE3-95E-6FN484C is a LatticeECP3 family Field Programmable Gate Array (FPGA) in a 484‑ball BGA package optimized for high-performance, cost-sensitive designs. This commercial‑grade, surface‑mount device offers a high logic capacity and substantial on‑chip RAM to support demanding digital signal processing, protocol bridging, and high‑density I/O integration.

Designed for applications that require a balance of performance and integration, the device operates from a 1.14 V to 1.26 V core supply and supports an ambient temperature range of 0 °C to 85 °C while meeting RoHS compliance requirements.

Key Features

• Core Capacity — 92,000 logic elements to implement complex FPGA logic and system integration.
• On‑chip Memory — Approximately 4.53 Mbits of embedded memory (4,526,080 bits) for data buffering, packet storage, and local RAM needs.
• I/O and Package — 295 user I/Os in a 484‑ball BGA (supplier package: 484‑FPBGA, 23 × 23 mm) enabling dense board routing and high pin count systems. Mounting type: surface mount.
• Low‑voltage Core — Core supply range of 1.14 V to 1.26 V for modern low‑power system architectures.
• Commercial Temperature Grade — Rated for operation from 0 °C to 85 °C for typical commercial applications.
• Family‑level High‑speed Serial Support — LatticeECP3 family features embedded SERDES supporting data rates from 150 Mbps to 3.2 Gbps and multi‑protocol connectivity (family data); useful for high‑speed serial links and protocol bridging.
• Enhanced DSP and Timing Resources — Family architecture includes sysDSP slices and multiple PLL/DLL resources (family data indicates up to 10 PLLs and 2 DLLs) for high‑throughput multiply/accumulate and clocking flexibility.
• Configuration and System Features — Family supports SPI boot flash interfaces, dual‑boot images, soft error detect macro, and on‑chip oscillator for initialization (family capabilities documented in the datasheet).
• Regulatory — RoHS compliant.

Typical Applications

• Networking & Communications — Implement protocol bridging, packet processing, and high‑speed serial interfaces using the device's dense logic and family SERDES capabilities.
• Video & Broadcast — Support video transport and formatting functions that benefit from large memory and DSP slice resources (family DSP and memory features).
• High‑Density I/O Systems — Use the 295 I/Os and compact 23 × 23 mm 484‑ball package for boards that require many interfaces in limited PCB area.
• Signal Processing & Data Acquisition — Leverage on‑chip memory and DSP resources for buffering, filtering, and aggregate math operations.

Unique Advantages

• High Logic Integration: 92,000 logic elements enable consolidation of multiple functions into a single FPGA, reducing BOM and board complexity.
• Substantial Embedded Memory: Approximately 4.53 Mbits of on‑chip RAM supports local data storage and low‑latency buffering without external memory.
• Dense I/O in a Compact Package: 295 I/Os in a 484‑ball (23 × 23 mm) FPBGA provide high connectivity while conserving board space.
• Low‑Voltage Operation: 1.14 V to 1.26 V core supply aligns with modern low‑power system design practices.
• Commercial Grade with Compliance: Designed for commercial temperature ranges and RoHS compliance for broad deployment in consumer and enterprise products.
• Family Ecosystem Features: LatticeECP3 family capabilities such as embedded SERDES, sysDSP, and flexible configuration options simplify integration of high‑speed interfaces and DSP workloads (family‑level features documented in the datasheet).

Why Choose LFE3-95E-6FN484C?

The LFE3-95E-6FN484C positions itself as a highly integrated FPGA solution for designs that require substantial logic, significant on‑chip memory, and a high count of user I/Os in a compact, surface‑mount BGA package. Its commercial operating range, low‑voltage core, and family features for high‑speed serial links and DSP processing make it suitable for cost‑sensitive, high‑performance applications.

Engineers targeting protocol bridging, signal processing, or dense interface consolidation will benefit from the device’s balance of logic capacity, embedded RAM, and I/O density, backed by the LatticeECP3 family feature set detailed in the datasheet.

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