LFE3-70EA-9FN672C

The LFE3-70EA-9FN672C is a commercial‑grade FPGA from Lattice Semiconductor’s ECP3 family, providing a balanced mix of logic capacity, embedded memory and high‑speed I/O in a 672‑ball BGA footprint. This device implements reconfigurable SRAM fabric and is targeted at high‑volume, high‑speed, cost‑sensitive applications that require DSP resources, multiple SERDES channels and flexible I/O options.

Key Features

• Core Logic  Approximately 67,000 logic elements enabling medium-to-high density design integration.
• Embedded Memory  Approximately 4.53 Mbits of on‑chip RAM (4,526,080 total RAM bits) for data buffering and on‑chip storage.
• DSP and Arithmetic  sysDSP slice architecture from the ECP3 family provides cascaded multiply‑accumulate capabilities and high‑performance ALU operations.
• High‑Speed SERDES  Embedded SERDES support with device family data rates up to 3.2 Gbps and package options providing multiple serial channels (ECP3 family configurations include multi‑channel SERDES support).
• Flexible I/O  380 user I/Os with programmable sysI/O buffer options and support for a wide range of parallel and differential standards as defined for the ECP3 family.
• Configuration and System Support  Flexible device configuration including SPI boot flash interface, dual‑boot image support and on‑chip oscillator for initialization.
• Package and Power  672‑ball BGA (supplier package: 672‑FPBGA, 27 × 27 mm) in a surface‑mount form factor; core voltage supply range 1.14 V to 1.26 V.
• Operating Range and Compliance  Commercial grade device with operating temperature range 0 °C to 85 °C and RoHS compliance.

Typical Applications

• High‑speed serial interfaces  Implement multi‑channel SERDES links such as PCI Express, 1GbE/SGMII/XAUI and other serial protocols supported by the ECP3 family.
• Telecom and networking  Support for SONET/SDH, CPRI and Serial RapidIO protocols where deterministic latency and on‑chip DSP are required.
• Video and broadcast transport  Processing and transport functions for SMPTE 3G and other high‑bandwidth media interfaces utilizing the device’s SERDES and memory resources.
• Memory interface and buffering  Dedicated DDR/DDR2/DDR3 memory support and abundant embedded RAM for controller logic, data capture and buffering tasks.

Unique Advantages

• High logic density: 67,000 logic elements let you integrate substantial system functions on a single device, reducing external glue logic.
• Significant on‑chip memory: Approximately 4.53 Mbits of embedded RAM supports complex buffering and state storage without external memory.
• Extensive I/O and SERDES capability: 380 I/Os and multi‑channel SERDES support enable flexible interface options for modern high‑speed designs.
• Optimized DSP resources: sysDSP slice architecture provides dedicated multiplier/accumulate resources for signal processing and algorithm acceleration.
• Compact, manufacturable package: 672‑ball FPBGA (27 × 27 mm) surface‑mount package provides a balance of I/O count and board area for volume production.
• Commercial‑grade readiness: 0 °C to 85 °C operating range and RoHS compliance align with standard commercial product requirements.

Why Choose LFE3-70EA-9FN672C?

The LFE3-70EA-9FN672C delivers a practical combination of logic density, embedded memory and high‑speed I/O in a production‑friendly 672‑ball package. It is well suited to designs that require integrated DSP capability, multi‑protocol serial interfaces and substantial on‑chip buffering while maintaining a commercial‑grade profile and RoHS compliance.

Engineers developing high‑throughput communications, video transport or complex memory‑interfacing systems will find the device’s mix of resources and configuration flexibility useful for consolidating functions, reducing BOM count and accelerating time to market within cost‑sensitive programs.

Request a quote or contact sales to discuss availability, pricing and technical support for LFE3-70EA-9FN672C.