LFE3-70EA-9FN484C
| Part Description |
ECP3 Field Programmable Gate Array (FPGA) IC 295 4526080 67000 484-BBGA |
|---|---|
| Quantity | 652 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Not For New Designs |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA | Number of I/O | 295 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 8375 | Number of Logic Elements/Cells | 67000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 4526080 |
Overview of LFE3-70EA-9FN484C – ECP3 Field Programmable Gate Array (FPGA) IC
The LFE3-70EA-9FN484C is an ECP3 family FPGA from Lattice Semiconductor Corporation, delivered in a 484-ball BGA package. It provides a large programmable fabric with 67,000 logic elements and approximately 4.5 Mbits of embedded RAM, supporting designs that require significant on-chip logic and memory resources.
This device is supplied in a surface-mount 484-FPBGA (23×23) package, operates from a 1.14 V to 1.26 V core supply, and is specified for commercial temperature operation from 0 °C to 85 °C. It is RoHS compliant.
Key Features
- Logic Capacity 67,000 logic elements for implementing complex, high-density digital logic and custom IP.
- Configurable Logic Blocks Large FPGA fabric suitable for a wide range of programmable functions.
- On‑Chip Memory Approximately 4.5 Mbits of embedded RAM to support buffering, state storage, and local data processing.
- I/O Count 295 available I/O pins to support multiple interfaces and high-pin-count designs.
- Package and Mounting 484-BBGA package (supplier device package: 484-FPBGA, 23×23) with surface-mount construction for PCB assembly.
- Power Core voltage range 1.14 V to 1.26 V to match low-voltage system architectures.
- Operating Range Commercial grade operation from 0 °C to 85 °C.
- Environmental Compliance RoHS compliant.
Typical Applications
- Custom digital logic Use the 67,000 logic elements to implement application‑specific datapaths, protocol logic, and control functions.
- On‑chip buffering and memory Leverage approximately 4.5 Mbits of embedded RAM for frame buffering, FIFO structures, and localized data storage.
- High‑pin‑count interface consolidation 295 I/Os accommodate multiple peripheral and bus connections on a single FPGA device.
Unique Advantages
- High integration: Combines extensive logic capacity and sizable embedded RAM in a single device to reduce external components and board-level complexity.
- Generous I/O availability: 295 I/Os enable consolidation of multiple interfaces and simplify signal routing for complex systems.
- Compact package: 484-BBGA / 484-FPBGA (23×23) delivers high density in a surface-mount form factor suitable for compact PCBs.
- Low core-voltage support: Operates at a 1.14 V to 1.26 V core range to match modern low-voltage system designs.
- Commercial temperature rating: Specified for 0 °C to 85 °C operation for standard embedded and electronic systems.
- Regulatory compliance: RoHS compliance supports environmentally conscious manufacturing requirements.
Why Choose LFE3-70EA-9FN484C?
The LFE3-70EA-9FN484C delivers a balance of large programmable logic capacity, meaningful on‑chip RAM, and a high I/O count in a compact BGA package. Its electrical and thermal specifications—1.14 V to 1.26 V core voltage and 0 °C to 85 °C operating range—make it appropriate for commercial embedded designs that need significant programmable resources without expanding board area.
This FPGA is suited to engineering teams seeking a highly integrated, RoHS‑compliant device from a recognized semiconductor manufacturer, enabling consolidation of logic, memory, and I/O into a single component to streamline design and procurement.
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