LFE3-70EA-8FN484I

IC FPGA 295 I/O 484FBGA
Part Description

ECP3 Field Programmable Gate Array (FPGA) IC 295 4526080 67000 484-BBGA

Quantity 1,273 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package484-FPBGA (23x23)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case484-BBGANumber of I/O295Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs8375Number of Logic Elements/Cells67000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits4526080

Overview of LFE3-70EA-8FN484I – ECP3 FPGA, 67K Logic Elements, 484-BBGA

The LFE3-70EA-8FN484I is a Lattice ECP3 family Field Programmable Gate Array (FPGA) in a 484-BBGA surface-mount package. It delivers 67,000 logic elements with approximately 4.53 Mbits of on-chip RAM and up to 295 user I/Os, targeting industrial embedded designs that require a balance of logic density, on-chip memory and flexible I/O.

Built on the ECP3 architecture, this device is appropriate for high-performance communications, signal processing, and system integration tasks where configurable logic, embedded DSP capabilities and high-speed serial interfaces are needed.

Key Features

  • Logic Capacity 67,000 logic elements to implement complex programmable logic and control functions.
  • Embedded Memory Approximately 4.53 Mbits of total on-chip RAM (4,526,080 bits) for buffering, packet processing and local data storage.
  • I/O Count & Package 295 user I/Os in a 484-BBGA package; supplier device package listed as 484-FPBGA (23×23 mm), surface mount.
  • Core Power Core supply range 1.14 V to 1.26 V to match system power rails and power-management schemes.
  • Industrial Temperature Rated operating range from -40 °C to 100 °C for industrial environments.
  • Family-Level High-Speed Interfaces ECP3 family features embedded SERDES supporting data rates up to 3.2 Gbps and multiple channel protocols for high-speed serial links (as documented for the family).
  • DSP & Clock Resources ECP3 family sysDSP architecture and sysCLOCK resources (family supports up to ten PLLs and two DLLs per device) to accelerate multiply-accumulate and timing tasks.
  • Compliance RoHS compliant.

Typical Applications

  • High-Speed Communications Use for protocol bridging, SERDES-based link termination and line-rate packet processing leveraging the family’s high-speed serial capabilities.
  • Video and Broadcast Processing Implement video transport, frame buffering and format conversion where on-chip memory and DSP resources are required.
  • Industrial Control & Automation Deploy for motor control, sensor interfacing and deterministic I/O aggregation in industrial temperature environments.
  • Embedded Compute Acceleration Offload compute-intensive tasks via the device’s logic density and sysDSP slices for real-time signal processing functions.

Unique Advantages

  • Balanced Logic and Memory: 67,000 logic elements paired with approximately 4.53 Mbits of embedded RAM simplifies designs that need local buffering and moderate compute density.
  • High I/O Count in a Compact Package: 295 I/Os in a 23×23 mm 484-FPBGA package enables dense interfacing without a large footprint.
  • Industrial Temperature Range: Specified operation from -40 °C to 100 °C supports deployment in harsh or temperature-variable environments.
  • Configurable High-Speed Connectivity: Family-level SERDES and source-synchronous I/O support enable integration of multi-protocol serial links and memory interfaces.
  • Power-Managed Core Supply: Narrow core voltage window (1.14–1.26 V) facilitates stable power sequencing and predictable power delivery design.
  • Standards and Compliance: RoHS compliance helps meet environmental and regulatory requirements for manufacturing and shipping.

Why Choose LFE3-70EA-8FN484I?

The LFE3-70EA-8FN484I positions itself as a versatile mid-density FPGA option within the Lattice ECP3 family, combining significant logic capacity, multi-megabit embedded memory and a high I/O count in a compact surface-mount 484-BBGA package. Its industrial operating range and family-level features—such as embedded SERDES, sysDSP slices and flexible clocking—make it suitable for communication, signal processing and industrial applications that require reliable, configurable hardware acceleration.

Designers and procurement teams seeking a robust FPGA with balanced resources and clear electrical and thermal parameters will find this device well suited for projects that demand on-chip memory, dense I/O and industrial temperature capability, with the ECP3 ecosystem and documentation available for design integration.

Request a quote or submit an inquiry to obtain pricing, lead time and availability for the LFE3-70EA-8FN484I.

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