LFE3-70EA-8FN484I
| Part Description |
ECP3 Field Programmable Gate Array (FPGA) IC 295 4526080 67000 484-BBGA |
|---|---|
| Quantity | 1,273 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA | Number of I/O | 295 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 8375 | Number of Logic Elements/Cells | 67000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 4526080 |
Overview of LFE3-70EA-8FN484I – ECP3 FPGA, 67K Logic Elements, 484-BBGA
The LFE3-70EA-8FN484I is a Lattice ECP3 family Field Programmable Gate Array (FPGA) in a 484-BBGA surface-mount package. It delivers 67,000 logic elements with approximately 4.53 Mbits of on-chip RAM and up to 295 user I/Os, targeting industrial embedded designs that require a balance of logic density, on-chip memory and flexible I/O.
Built on the ECP3 architecture, this device is appropriate for high-performance communications, signal processing, and system integration tasks where configurable logic, embedded DSP capabilities and high-speed serial interfaces are needed.
Key Features
- Logic Capacity 67,000 logic elements to implement complex programmable logic and control functions.
- Embedded Memory Approximately 4.53 Mbits of total on-chip RAM (4,526,080 bits) for buffering, packet processing and local data storage.
- I/O Count & Package 295 user I/Os in a 484-BBGA package; supplier device package listed as 484-FPBGA (23×23 mm), surface mount.
- Core Power Core supply range 1.14 V to 1.26 V to match system power rails and power-management schemes.
- Industrial Temperature Rated operating range from -40 °C to 100 °C for industrial environments.
- Family-Level High-Speed Interfaces ECP3 family features embedded SERDES supporting data rates up to 3.2 Gbps and multiple channel protocols for high-speed serial links (as documented for the family).
- DSP & Clock Resources ECP3 family sysDSP architecture and sysCLOCK resources (family supports up to ten PLLs and two DLLs per device) to accelerate multiply-accumulate and timing tasks.
- Compliance RoHS compliant.
Typical Applications
- High-Speed Communications Use for protocol bridging, SERDES-based link termination and line-rate packet processing leveraging the family’s high-speed serial capabilities.
- Video and Broadcast Processing Implement video transport, frame buffering and format conversion where on-chip memory and DSP resources are required.
- Industrial Control & Automation Deploy for motor control, sensor interfacing and deterministic I/O aggregation in industrial temperature environments.
- Embedded Compute Acceleration Offload compute-intensive tasks via the device’s logic density and sysDSP slices for real-time signal processing functions.
Unique Advantages
- Balanced Logic and Memory: 67,000 logic elements paired with approximately 4.53 Mbits of embedded RAM simplifies designs that need local buffering and moderate compute density.
- High I/O Count in a Compact Package: 295 I/Os in a 23×23 mm 484-FPBGA package enables dense interfacing without a large footprint.
- Industrial Temperature Range: Specified operation from -40 °C to 100 °C supports deployment in harsh or temperature-variable environments.
- Configurable High-Speed Connectivity: Family-level SERDES and source-synchronous I/O support enable integration of multi-protocol serial links and memory interfaces.
- Power-Managed Core Supply: Narrow core voltage window (1.14–1.26 V) facilitates stable power sequencing and predictable power delivery design.
- Standards and Compliance: RoHS compliance helps meet environmental and regulatory requirements for manufacturing and shipping.
Why Choose LFE3-70EA-8FN484I?
The LFE3-70EA-8FN484I positions itself as a versatile mid-density FPGA option within the Lattice ECP3 family, combining significant logic capacity, multi-megabit embedded memory and a high I/O count in a compact surface-mount 484-BBGA package. Its industrial operating range and family-level features—such as embedded SERDES, sysDSP slices and flexible clocking—make it suitable for communication, signal processing and industrial applications that require reliable, configurable hardware acceleration.
Designers and procurement teams seeking a robust FPGA with balanced resources and clear electrical and thermal parameters will find this device well suited for projects that demand on-chip memory, dense I/O and industrial temperature capability, with the ECP3 ecosystem and documentation available for design integration.
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