LFE3-70EA-7FN672C

The LFE3-70EA-7FN672C is an ECP3 family Field Programmable Gate Array (FPGA) supplied in a 672-ball BGA package for surface-mount assembly. It provides a large programmable fabric—approximately 67,000 logic elements—and substantial on-chip memory and I/O resources for commercial-temperature digital designs.

With a specified core supply range of 1.14 V to 1.26 V and an operating temperature range of 0 °C to 85 °C, this device is intended for commercial applications that require significant embedded memory and high I/O density in a compact 27 × 27 mm FPBGA footprint.

Key Features

• Programmable Logic Capacity  Approximately 67,000 logic elements to implement custom digital functions and complex state machines.
• Embedded Memory  Approximately 4.53 Mbits of on-chip RAM (4,526,080 bits) to support buffering, FIFOs and local data storage.
• I/O Density  Up to 380 user I/O pins for interfacing to external devices, peripherals and parallel buses.
• Power Supply  Core supply operating range of 1.14 V to 1.26 V, enabling predictable integration with regulated power rails.
• Package and Mounting  672-ball BGA (supplier package: 672-FPBGA, 27×27 mm) optimized for surface-mount PCB assembly and compact system layouts.
• Operating Grade  Commercial grade device rated for 0 °C to 85 °C ambient operation.
• Standards  RoHS-compliant construction.

Typical Applications

• Custom Digital Logic  Implements application-specific processing and control logic where programmable hardware is required.
• High‑I/O Interface Controllers  Supports designs needing a large number of external signal connections through its 380 I/O capability.
• On‑chip Buffering and Data Storage  Uses the approximately 4.53 Mbits of embedded RAM for data buffering, packet queues or temporary storage close to logic.

Unique Advantages

• Large Logic Resource: Approximately 67,000 logic elements enable implementation of sizable custom logic functions without external ASICs.
• Substantial Embedded Memory: Roughly 4.53 Mbits of on-chip RAM reduces dependence on external memory for many buffering and storage tasks.
• High I/O Count: 380 I/O pins provide flexibility to connect multiple peripherals, sensors or parallel interfaces directly to the FPGA.
• Compact, Assembly‑Friendly Package: 672-ball FPBGA (27 × 27 mm) supports dense PCB layouts while remaining surface-mount compatible.
• Commercial Temperature Rating: Qualified for 0 °C to 85 °C operation to match typical commercial electronic product requirements.
• RoHS Compliant: Built to meet lead-free manufacturing and environmental compliance expectations.

Why Choose LFE3-70EA-7FN672C?

The LFE3-70EA-7FN672C balances a high logic element count, ample embedded RAM and a large I/O complement in a compact FPBGA package, making it suitable for commercial designs that require significant on-chip resources and interface density. Its defined core voltage range and commercial temperature rating help simplify power and thermal planning for standard product environments.

This device is well suited to design teams seeking a programmable hardware platform with measurable resources—logic elements, memory and I/O—to consolidate functions, reduce external component count and maintain flexibility through field-programmable logic.

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