LFE3-70EA-7FN1156I

The LFE3-70EA-7FN1156I is a Lattice Semiconductor ECP3 family field programmable gate array (FPGA) supplied in a 1156-ball BGA package. It provides a mid-to-high density FPGA fabric with 67,000 logic elements and extensive on-chip memory and I/O for complex embedded and high-speed designs.

Designed for high-volume, high-speed, cost-conscious applications, this industrial-grade device combines abundant logic, approximately 4.53 Mbits of embedded memory, and up to 490 user I/Os to enable system integration, signal processing, and high-speed interface implementations.

Key Features

• Programmable Logic 67,000 logic elements provide substantial capacity for glue logic, control, and custom processing blocks within a single device.
• On-chip Memory Approximately 4.53 Mbits of total RAM bits for embedded block RAM and distributed storage to support buffering, FIFOs, and local scratch memory.
• I/O Density 490 user I/Os in the 1156-BBGA footprint enable wide parallel interfaces and high-pin-count connectivity for complex systems.
• Embedded SERDES and High-speed Interfaces ECP3 family features include embedded SERDES with data-rate capability up to 3.2 Gbps and support for a range of serial protocols and source-synchronous interfaces.
• DSP and Math Acceleration The family’s sysDSP architecture (as described in the ECP3 family datasheet) supports cascaded slices and high-performance multiply-accumulate operations for signal processing workloads.
• Clocking and Timing Multiple PLLs/DLLs are available in the ECP3 family for flexible clock management and frequency synthesis in timing-critical designs.
• Power and Packaging Core supply range of 1.14 V to 1.26 V and surface-mount 1156-FPBGA (35×35 mm) package suited to dense board-level integration.
• Industrial Temperature Rating Rated for operation from −40 °C to 100 °C to meet demanding environmental requirements.
• Standards and Tools (Family-level) ECP3 family documentation notes system-level support including configuration utilities and on-chip features to simplify development and deployment.

Typical Applications

• High-speed serial interfaces — Implement PCI Express, Ethernet, and other SERDES-based protocols using the ECP3 family’s embedded SERDES and high-speed I/O.
• Signal processing and DSP — Use the sysDSP slice architecture and arithmetic resources for filtering, MAC-heavy algorithms, and real-time processing.
• Network and telecom line cards — Leverage abundant logic, on-chip memory, and high I/O counts for packet handling, protocol bridging, and interface aggregation.
• Industrial control and automation — Industrial temperature rating and high I/O density support motor control, sensor aggregation, and deterministic control logic.

Unique Advantages

• Highly integrated compute and I/O: 67,000 logic elements combined with 490 I/Os reduce the need for external glue logic and simplify system design.
• Embedded memory for local buffering: Approximately 4.53 Mbits of on-chip RAM enables efficient data staging and low-latency storage without external memory in many use cases.
• Designed for high-speed links: Family-level SERDES and source-synchronous I/O support accelerate implementation of multi-gigabit serial protocols.
• Robust operating range: Industrial temperature rating (−40 °C to 100 °C) suits deployments in demanding environments.
• Compact, manufacturable package: The 1156-FPBGA (35×35 mm) surface-mount package balances pin count and board footprint for production designs.
• Flexible core power: 1.14 V to 1.26 V supply range aligns with typical FPGA core requirements for power and thermal planning.

Why Choose LFE3-70EA-7FN1156I?

The LFE3-70EA-7FN1156I positions itself as a capable mid-to-high density member of the Lattice ECP3 family, delivering a balance of logic capacity, embedded memory, and high I/O count for complex embedded and communications systems. Its industrial temperature rating and surface-mount 1156-BBGA package make it suitable for rugged production deployments where integration and board-level density matter.

For teams targeting scalable signal processing, high-speed interface implementations, or dense system integration, this device offers measurable on-chip resources and family-level features that streamline development and reduce external BOM count, supported by Lattice’s documented family tools and configuration options.

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