LFE3-70EA-7FN484I

The LFE3-70EA-7FN484I is an industrial-grade Lattice ECP3 FPGA in a 484-BBGA (484-FPBGA, 23×23 mm) surface-mount package. It delivers a dense programmable fabric with 67,000 logic elements and a broad set of system-level resources targeted at communications, industrial and high-speed interface applications.

Designed for applications that require substantial on-chip memory, extensive I/O and configurable high-speed serial interfaces, this device combines the ECP3 family’s DSP-friendly architecture and flexible I/O support with an industrial temperature range and RoHS compliance.

Key Features

• Programmable Core  67,000 logic elements provide a large, configurable logic fabric for complex glue logic, protocol handling and custom processing blocks.
• Embedded Memory  Approximately 4.5 Mbits of on-chip RAM (total RAM bits: 4,526,080) to support buffers, FIFOs and on-chip data storage.
• I/O Capacity  295 user I/Os in the 484-BBGA package enable wide parallel interfaces and dense peripheral connectivity.
• Embedded SERDES  Family-level embedded SERDES support spans data rates from 150 Mbps to 3.2 Gbps; in the 484-FPBGA package this device is offered with the corresponding SERDES channel allocation shown for the ECP3-70.
• DSP Resources (sysDSP)  ECP3 sysDSP architecture provides cascaded slices and wide ALU operations for multiply–accumulate tasks and high-performance DSP functions (as documented for the ECP3 family).
• Flexible sysI/O™ Buffer  Supports a wide range of I/O standards including LVTTL, LVCMOS, SSTL, HSTL, LVDS and others (per ECP3 family specifications), plus on-chip termination and optional input equalization.
• Power and Supply  Core voltage operation specified at 1.14 V to 1.26 V for compatibility with standard 1.2 V systems.
• Package and Mounting  484-BBGA (484-FPBGA, 23×23 mm) surface-mount package offering high I/O density for compact board designs.
• Industrial Temperature Range  Rated for operation from −40 °C to 100 °C, suitable for harsh-environment deployments.
• Compliance  RoHS compliant.

Typical Applications

• Telecommunications & Networking  Implement protocol engines, packet processing, and SERDES-based links for Ethernet, SONET/SDH and other high-speed interfaces.
• Broadcast & Video Transport  Support SMPTE and high-speed serial video interfaces where on-chip memory and DSP functions buffer and process streaming data.
• Industrial Control & Automation  Provide deterministic I/O, custom control logic and embedded memory for sensor aggregation, motor control interfaces and machine communication.
• Interface Bridging & Aggregation  Integrate diverse parallel and serial interfaces with abundant I/Os and programmable logic to consolidate functions and simplify BOMs.

Unique Advantages

• High integration density: 67,000 logic elements and roughly 4.5 Mbits of embedded memory reduce the need for external components and simplify board design.
• Broad I/O flexibility: 295 user I/Os and on-chip support for multiple I/O standards enable direct interfacing to a wide range of peripherals and memory types.
• High-speed serial capability: Family-level SERDES support covering 150 Mbps–3.2 Gbps enables implementation of common serial protocols and links.
• Industrial robustness: −40 °C to 100 °C operating range and RoHS compliance make the device suitable for demanding embedded and industrial applications.
• Comprehensive configuration and debug support: Family features include dual-boot configuration options, Reveal Logic Analyzer and ORCAstra configuration utilities to streamline development and field updates.
• Compact, high-density package: 484-FPBGA (23×23 mm) packaging delivers a high I/O count in a compact footprint for space-constrained designs.

Why Choose LFE3-70EA-7FN484I?

The LFE3-70EA-7FN484I positions itself as a highly integrated, industrial-grade FPGA option within the Lattice ECP3 family—combining substantial logic capacity, multi-megabit on-chip RAM and extensive I/O in a compact 484-BBGA package. Its 1.14–1.26 V core supply, embedded SERDES capability and DSP-friendly architecture make it suitable for designs that require a balance of performance, integration and configurability.

This device is well suited for designers building telecommunications equipment, broadcast interfaces, industrial controllers and mixed-parallel/serial systems who need a reliable FPGA platform with established family-level tools and configuration features for development and field updates.

Request a quote or submit an inquiry for part number LFE3-70EA-7FN484I to receive pricing and availability information tailored to your project needs.