LFE3-70EA-6LFN484C
| Part Description |
ECP3 Field Programmable Gate Array (FPGA) IC 295 4526080 67000 484-BBGA |
|---|---|
| Quantity | 315 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA | Number of I/O | 295 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 8375 | Number of Logic Elements/Cells | 67000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 4526080 |
Overview of LFE3-70EA-6LFN484C – ECP3 FPGA, 67,000 Logic Elements, 295 I/Os, 484-BBGA
The LFE3-70EA-6LFN484C is a Lattice ECP3 family Field Programmable Gate Array (FPGA) in a 484-ball BGA package. It delivers a reconfigurable SRAM-based FPGA fabric with 67,000 logic elements and robust on-chip memory suitable for high-volume, high-speed, cost-sensitive applications.
Built for system integration, the device combines substantial logic capacity, embedded RAM and high pin count I/O to address communications, signal-processing and general-purpose embedded logic tasks while operating within a commercial temperature range.
Key Features
- Logic Capacity — 67,000 logic elements provide significant gate density for complex logic and control functions.
- Embedded Memory — Approximately 4.53 Mbits of on-chip RAM (4,526,080 total RAM bits) for frame buffering, FIFOs and embedded data storage.
- I/O Density — 295 user I/Os support wide parallel interfaces and high pin-count designs in the 484-ball BGA package.
- High-speed SERDES and Interfaces — Family features include embedded SERDES with multi-hundred Mbps to multiple-Gbps capability (family-level support up to 3.2 Gbps) for serial protocols and high-speed links.
- sysDSP and DSP Resources — Family sysDSP slice architecture supports high-performance multiply/accumulate operations for signal processing workloads.
- Flexible Memory and Timing — Multiple embedded block RAM resources, PLLs and DLLs (family-level features) enable flexible clocking and deterministic timing for complex systems.
- Configuration and System Support — Supports SPI boot flash interface, dual-boot images, on-chip oscillator and system-level utilities as described for the ECP3 family.
- Package & Mounting — 484-BBGA (supplier package 484-FPBGA, 23 × 23 mm) in a surface-mount form factor for automated PCB assembly.
- Power & Operating Range — Core supply range of 1.14 V to 1.26 V with commercial operating temperature of 0 °C to 85 °C; RoHS compliant.
Typical Applications
- High-speed serial communications — Use embedded SERDES channels for protocol interfaces such as PCI Express, Ethernet, Serial RapidIO and other high-speed links (family-level support).
- Signal processing and media — Leverage sysDSP slices and embedded RAM for DSP, video pre-processing and real-time data path acceleration.
- Memory interface and buffering — Implement DDR/DDR2/DDR3 controllers and source-synchronous memory interfaces using on-chip memory and dedicated I/O features (family-level functionality).
- Embedded control and glue logic — Replace multi-component glue logic with a single FPGA to simplify board design and consolidate control functions using abundant I/Os and logic resources.
Unique Advantages
- High logic density: 67,000 logic elements enable complex SoC-style integration and feature consolidation.
- Substantial embedded memory: Approximately 4.53 Mbits of RAM reduces external memory needs for buffering and local storage.
- Versatile I/O and package: 295 I/Os in a 484-BBGA (23 × 23 mm) package supports dense interfaces while remaining surface-mount compatible for volume assembly.
- Designed for high-speed links: Family SERDES and pre-engineered source-synchronous support ease implementation of high-bandwidth serial and memory interfaces.
- Commercial temperature and RoHS compliance: Rated 0 °C to 85 °C and RoHS compliant for mainstream electronic products.
- Flexible configuration options: SPI boot, dual-boot images and on-chip oscillator options simplify system bring-up and field updates.
Why Choose LFE3-70EA-6LFN484C?
The LFE3-70EA-6LFN484C positions itself as a practical, high-capacity FPGA option within the Lattice ECP3 family, combining 67,000 logic elements, several megabits of embedded RAM and a high I/O count in a compact 484-ball BGA. It is well suited to designers who need to consolidate functionality, implement high-speed serial or parallel interfaces, and streamline BOMs for cost-sensitive, high-volume products.
With family-provided features for DSP acceleration, SERDES connectivity and flexible configuration, this device offers a balance of performance and integration for communications, signal processing and embedded control applications while meeting commercial-grade operating requirements.
If you would like pricing, availability or to request a formal quote for LFE3-70EA-6LFN484C, please submit a quote request or sales inquiry detailing your quantity and delivery requirements.

Date Founded: 1983
Headquarters: Hillsboro, Oregon, USA
Employees: 1,000+
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Certifications and Memberships: ISO9001:2015, ISO14001:2015, IATF16949:2016