LFE3-70E-7FN1156C

The LFE3-70E-7FN1156C is an ECP3 family FPGA from Lattice Semiconductor Corporation designed for mid-density, reconfigurable logic integration. It provides a balance of programmable logic, on-chip memory and DSP resources suitable for communications, video, and general-purpose embedded applications.

This surface-mount device combines 67,000 logic elements, approximately 4.53 Mbits of embedded memory, and 490 user I/Os in a 1156-BBGA (1156-FPBGA, 35×35 mm) package, operating from a 1.14 V to 1.26 V core supply and rated for commercial temperature use (0 °C to 85 °C).

Key Features

• Logic Capacity — 67,000 logic elements suitable for mid-density system integration and complex logic functions.
• Embedded Memory — Approximately 4.53 Mbits of on-chip RAM (4,526,080 bits) for buffering, frame storage, and state retention.
• High I/O Count — 490 user I/Os to support broad peripheral and bus interfacing requirements in a single device.
• DSP Resources — sysDSP architecture with support for multiple multiplier configurations; ECP3-70 device class includes 128 18×18 multipliers for signal processing tasks.
• Embedded SERDES — Family-level embedded SERDES support with data rates from 150 Mbps to 3.2 Gbps for multi-gigabit serial interfaces and protocol bridging.
• Clocking and Timing — On-chip PLLs and DLLs (family supports up to ten PLLs and two DLLs) for flexible clock management and phase alignment.
• Flexible I/O Standards — Programmable I/O buffer options and source-synchronous support suitable for a wide range of parallel and differential interfaces.
• Package and Mounting — 1156-BBGA (supplier device package: 1156-FPBGA, 35×35 mm) surface-mount package for high-density board designs.
• Power and Temperature — Core voltage range 1.14 V to 1.26 V; commercial operating range 0 °C to 85 °C.
• RoHS Compliant — Meets RoHS requirements for lead-free assembly and environmental compliance.

Typical Applications

• Networking & Communications — Multi-gigabit serial interfaces and programmable logic for protocol bridging and packet processing using embedded SERDES and DSP resources.
• Video and Broadcast — Frame buffering, video formatting, and timing control using the device's on-chip RAM and DSP multipliers.
• Industrial Control — Custom I/O aggregation, real-time processing and control logic leveraging high I/O count and reprogrammability.
• Embedded Systems — System integration tasks such as peripheral aggregation, custom accelerators and interface conversion where dense logic and memory are required.

Unique Advantages

• High Logic Density: 67,000 logic elements enable consolidation of multiple functions into a single device, reducing board-level complexity.
• Substantial On‑Chip Memory: Approximately 4.53 Mbits of embedded RAM supports buffering and large data structures without external memory.
• Rich DSP Capability: 128 18×18 multipliers (ECP3-70 class) provide efficient arithmetic performance for signal processing and algorithm acceleration.
• Extensive I/O Resources: 490 user I/Os allow flexible interfacing to sensors, peripherals and high-speed buses without additional devices.
• Configurable Clocking: Multiple PLLs/DLLs (family-supported counts) enable precise timing and multi‑domain clocking for complex systems.
• Compliance and Assembly Ready: RoHS compliance and a surface-mount 1156-BBGA package simplify integration into modern assembly flows.

Why Choose LFE3-70E-7FN1156C?

The LFE3-70E-7FN1156C offers a balanced combination of programmable logic, embedded memory and DSP resources in a compact 1156-BBGA package, making it a strong choice for mid-density designs that require on-chip processing and flexible I/O. Its commercial-grade temperature range and RoHS compliance provide predictable behavior for mainstream embedded and communications products.

This device is suited to designers who need to consolidate multiple functions onto a single FPGA — reducing BOM and board complexity — while leveraging established family capabilities such as embedded SERDES, sysDSP slices and flexible clocking resources.

Request a quote or submit an inquiry to check availability and get pricing for the LFE3-70E-7FN1156C. Our team can provide lead-time details and support to evaluate this device in your next design.