LFE3-70E-6FN484I

The LFE3-70E-6FN484I is an ECP3 field programmable gate array (FPGA) designed for industrial-grade programmable logic applications. It integrates 67,000 logic elements, approximately 4.52608 Mbits of on-chip RAM, and 295 general-purpose I/O in a 484-ball BGA package for high-density system integration.

With a 1.14 V to 1.26 V core supply range, surface-mount FPBGA package, and an operating temperature range of -40 °C to 100 °C, this device targets designs that require significant logic capacity, embedded memory, and robust temperature performance.

Key Features

• Logic Capacity  67,000 logic elements provide the programmable resources needed for complex custom logic and signal processing functions.
• Embedded Memory  Approximately 4.52608 Mbits of on-chip RAM supports buffering, packet storage, and intermediate data working sets without external memory.
• I/O Density  295 device I/Os enable high connectivity for peripherals, sensors, and parallel interfaces in dense systems.
• Power  Core supply voltage range of 1.14 V to 1.26 V allows designers to plan power delivery and sequencing to meet board-level requirements.
• Package and Mounting  484-ball FPBGA (23 × 23 mm) surface-mount package delivers a compact footprint for space-constrained PCBs while supporting high pin count integration.
• Industrial Temperature Grade  Rated for operation from -40 °C to 100 °C, suitable for industrial environments and temperature-stressed applications.
• Regulatory Status  RoHS compliant, meeting common material restriction requirements for modern electronics manufacturing.

Typical Applications

• Industrial Automation  Programmable control and logic functions in industrial systems benefit from the device’s industrial temperature rating and substantial logic resources.
• Embedded Systems  High logic capacity and embedded RAM enable on-board custom processing and control tasks in compact embedded designs.
• High‑Density I/O Systems  With 295 I/Os, the device supports applications that require numerous parallel interfaces or signal routing across multiple subsystems.

Unique Advantages

• High Logic Integration: 67,000 logic elements consolidate complex digital functions into a single programmable device, reducing external logic count.
• On‑Chip Memory: Approximately 4.52608 Mbits of embedded RAM lowers dependency on external memory for buffering and temporary storage.
• Large I/O Count: 295 I/Os provide flexibility for interface-rich designs and reduce the need for additional I/O expanders.
• Industrial Robustness: Rated for -40 °C to 100 °C operation, enabling deployment in temperature-challenging environments.
• Compact, High‑Pin Package: 484-FPBGA (23×23) packaging supports high integration density while remaining suitable for surface-mount assembly.
• Regulatory Compliance: RoHS compliance supports modern manufacturing and environmental requirements.

Why Choose LFE3-70E-6FN484I?

The LFE3-70E-6FN484I offers a balanced combination of logic capacity, on-chip memory, and high I/O count in an industrial-temperature, surface-mount BGA package. Its specification set makes it suitable for engineers designing robust programmable logic solutions that require substantial embedded resources and connectivity.

This device is a fit for teams seeking a high-density FPGA option that supports compact PCB layouts, significant on-chip processing, and operation across an extended temperature range.

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