LFE3-70E-6FN484C

The LFE3-70E-6FN484C is an ECP3 Field Programmable Gate Array (FPGA) IC designed for flexible, reconfigurable logic in commercial embedded systems. It provides a high-density logic fabric combined with on-chip memory and a large I/O count to address applications that require significant programmable logic resources and interface connectivity.

With 67,000 logic elements, approximately 4.53 Mbits of embedded memory and support for up to 295 I/Os in a compact 484-ball BGA package, this device targets designers needing dense logic capacity, moderate memory, and extensive external interfacing in surface-mount form factors.

Key Features

• Core Logic  67,000 logic elements provide a substantial programmable fabric for implementing complex digital functions and custom processing pipelines.
• Embedded Memory  Total on-chip RAM of 4,526,080 bits (approximately 4.53 Mbits) supports data buffering, FIFOs, and local storage for high-throughput logic blocks.
• I/O Density  Supports up to 295 I/Os to accommodate multiple external interfaces, peripheral connections, and board-level signal routing.
• Power Supply  Operates from a core voltage supply range of 1.14 V to 1.26 V, enabling stable core operation within specified supply limits.
• Package & Mounting  Available in a 484-BBGA package (supplier device package: 484-FPBGA, 23×23) with surface-mount mounting for compact board integration.
• Operating Conditions  Commercial-grade device rated for 0 °C to 85 °C operation, suitable for mainstream consumer and industrial-adjacent applications within that temperature range.
• Environmental Compliance  RoHS compliant to support lead-free assembly and environmental regulatory requirements.

Typical Applications

• Interface Bridging and Protocol Conversion  High I/O count and flexible logic resources allow implementation of multi-protocol bridges and I/O expansion logic on a single device.
• Embedded System Acceleration  Large logic capacity and on-chip RAM enable offload of algorithmic or control tasks from a host processor for improved system responsiveness.
• Prototyping and Development  Reconfigurable fabric and broad I/O support make the device suitable for hardware prototyping and iterative design verification.
• Dense Board-level Integration  The 484-BBGA surface-mount package supports compact PCB designs that require significant programmable logic in a small footprint.

Unique Advantages

• High Logic Capacity: 67,000 logic elements provide headroom for complex state machines, custom datapaths, and parallel processing blocks.
• Meaningful On-chip Memory: Approximately 4.53 Mbits of embedded RAM reduces dependence on external memory for buffering and temporary storage.
• Extensive I/O Support: Up to 295 I/Os simplifies system integration by accommodating multiple external interfaces without adding external glue logic.
• Compact, Board-friendly Package: 484-BBGA (484-FPBGA 23×23) and surface-mount construction enable high-density board layouts and standard assembly flows.
• Commercial Temperature Suitability: Rated 0 °C to 85 °C to meet the needs of mainstream commercial applications.
• Regulatory Readiness: RoHS compliance supports lead-free manufacturing and environmental requirements.

Why Choose LFE3-70E-6FN484C?

The LFE3-70E-6FN484C positions itself as a high-density, commercially graded FPGA option for designers who need substantial programmable logic, on-chip memory, and ample I/O in a compact BGA package. Its combination of 67,000 logic elements, approximately 4.53 Mbits of embedded RAM, and 295 I/Os makes it suitable for embedded acceleration, protocol bridging, and dense board-level integration.

For teams focused on scalable, reconfigurable hardware solutions, this device offers a balance of logic capacity, memory resources, and package density that supports robust prototyping and production designs, while meeting RoHS requirements and standard commercial operating conditions.

Request a quote or submit an inquiry for pricing and availability of the LFE3-70E-6FN484C today. Our team will provide current lead times and ordering information to support your design schedule.