LFE3-70E-6FN672C

The LFE3-70E-6FN672C is an ECP3 family field programmable gate array (FPGA) offered in a 672-ball BGA package. It combines high logic capacity, substantial embedded RAM, and a wide set of I/O to support complex programmable logic implementations for commercial applications.

Key hardware attributes include 67,000 logic elements, approximately 4.53 Mbits of on-chip RAM, 380 I/Os, and a compact 672-FPBGA (27×27) package, operating from a low-voltage core supply and within a commercial temperature range.

Key Features

• Logic Capacity — 67,000 logic elements and 8,375 CLBs provide abundant programmable fabric for complex designs and mid-to-high density implementations.
• Embedded Memory — Approximately 4.53 Mbits of on-chip RAM to support data buffering, state storage, and on-chip processing tasks.
• I/O Density — 380 I/Os to support a broad set of external interfaces and parallel signal routing requirements.
• Package and Mounting — Supplied in a 672-BBGA / 672-FPBGA (27×27) package designed for surface-mount PCB assembly, enabling compact board designs.
• Power — Core voltage supply range of 1.14 V to 1.26 V for the device core.
• Operating Range — Commercial-grade operating temperature range of 0 °C to 85 °C.
• Environmental Compliance — RoHS compliant to meet standard environmental requirements.

Unique Advantages

• High programmable capacity: 67,000 logic elements enable complex logic and state machines without external processors for many tasks.
• Substantial on-chip RAM: Approximately 4.53 Mbits of embedded memory reduces dependence on external memory for buffering and intermediate storage.
• Extensive I/O count: 380 I/Os support multiple parallel interfaces and high-pin-count designs, simplifying board-level connectivity.
• Compact, surface-mount package: 672-FPBGA (27×27) packaging supports high-density PCB layouts while maintaining reliable solder mounting.
• Low-voltage core operation: 1.14 V to 1.26 V supply range helps align power budgeting for modern low-voltage systems.
• Commercial suitability and compliance: Commercial-grade temperature range (0 °C to 85 °C) and RoHS compliance align the device with standard commercial product requirements.

Why Choose LFE3-70E-6FN672C?

The LFE3-70E-6FN672C positions itself as a high-capacity, commercially graded FPGA option for designs that require significant programmable logic, embedded memory, and rich I/O in a compact BGA package. Its combination of 67,000 logic elements, approximately 4.53 Mbits of on-chip RAM, and 380 I/Os makes it well suited for mid-to-high complexity commercial applications where board space, integration, and deterministic hardware logic are primary considerations.

This device offers a practical balance of programmable resources, package density, and electrical characteristics for engineers and procurement teams seeking a RoHS-compliant FPGA with predictable supply and thermal parameters for commercial deployments.

Request a quote or submit a procurement inquiry to receive pricing, availability, and lead-time details for the LFE3-70E-6FN672C.