LFE3-35EA-9FN484I

The LFE3-35EA-9FN484I from Lattice Semiconductor Corporation is an ECP3-series Field Programmable Gate Array (FPGA) in a 484‑BBGA package designed for industrial applications. It combines 33,000 logic elements with approximately 1.36 Mbits of embedded memory and up to 295 I/Os to address I/O‑dense and compute‑centric designs that require robust operation across an extended temperature range.

Key Features

• Logic Capacity — 33,000 logic elements to implement medium-complexity custom logic and signal processing functions.
• Embedded Memory — Approximately 1.36 Mbits of on‑chip RAM for buffering, FIFOs, and small data storage needs.
• I/O Density — Up to 295 I/Os suitable for designs that aggregate multiple interfaces or require extensive external connectivity.
• Power Supply — Operates from a core voltage range of 1.14 V to 1.26 V to match system power rails and low‑voltage platforms.
• Package and Mounting — 484‑BBGA (supplier package: 484‑FPBGA, 23 × 23 mm) in a surface‑mount form factor for compact board integration.
• Industrial Temperature Range — Rated for operation from −40 °C to 100 °C, supporting deployment in industrial environments.
• Compliance — RoHS compliant for regulatory and environmental compatibility.

Typical Applications

• Industrial Control — Deterministic logic and interface aggregation for motor control, PLC I/O expansion, and factory automation where extended temperature support is required.
• Communication Gateways — Protocol bridging and packet processing using available logic resources and high I/O count to connect multiple serial and parallel interfaces.
• Embedded Signal Processing — Custom signal conditioning, finite-state machines, and hardware accelerators leveraging the 33,000 logic elements and on‑chip RAM.
• High‑Density I/O Systems — Board-level designs that require many external connections, sensors, or peripherals supported by up to 295 I/Os.

Unique Advantages

• High Logic Density: 33,000 logic elements enable substantial custom logic implementation without external ASICs or CPLDs.
• On‑Chip Memory: Approximately 1.36 Mbits of embedded RAM reduces dependence on off‑chip memory for buffering and temporary storage.
• Extensive I/O Capability: Up to 295 I/Os simplify board-level interfacing and reduce the need for additional interface chips.
• Industrial Reliability: Rated for −40 °C to 100 °C, making it suitable for deployments in demanding environmental conditions.
• Compact, Surface‑Mount Package: 484‑BBGA (23 × 23 mm) provides a high‑density solution for space‑constrained PCBs.
• Low‑Voltage Core: Core operation from 1.14 V to 1.26 V aligns with modern low‑voltage power architectures.

Why Choose LFE3-35EA-9FN484I?

The LFE3-35EA-9FN484I offers a balanced combination of logic density, on‑chip memory, and I/O capacity in a compact BGA package, targeted at designers who need programmable logic for industrial and I/O‑intensive systems. Its industrial temperature rating and RoHS compliance make it well suited for long‑life deployments where environmental robustness matters.

Backed by Lattice Semiconductor Corporation, this ECP3 FPGA variant is appropriate for engineering teams building scalable, medium‑complexity FPGA designs that require reliable operation, ample connectivity, and embedded memory resources.

Request a quote or submit a sales inquiry to receive pricing, availability, and ordering information for the LFE3-35EA-9FN484I.