LFE3-35EA-8LFN672I
| Part Description |
ECP3 Field Programmable Gate Array (FPGA) IC 310 1358848 33000 672-BBGA |
|---|---|
| Quantity | 1,997 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 672-FPBGA (27x27) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 672-BBGA | Number of I/O | 310 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 4125 | Number of Logic Elements/Cells | 33000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 1358848 |
Overview of LFE3-35EA-8LFN672I – ECP3 FPGA, 33,000 logic elements, 310 I/Os
The LFE3-35EA-8LFN672I is an ECP3 family Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation designed for high-density, cost-sensitive system integration. This device combines a dense logic fabric, embedded memory, and flexible I/O in a 672‑ball BGA package for industrial applications requiring wide temperature operation.
Built on the Lattice ECP3 architecture, the device targets high-volume, high-speed, low-cost applications and provides on-chip resources for DSP, SERDES, and source-synchronous interfaces to simplify system design and integration.
Key Features
- Logic Capacity — 33,000 logic elements provide a substantial programmable fabric for mid-range FPGA designs.
- Embedded Memory — Approximately 1.36 Mbits of on-chip RAM (1,358,848 total RAM bits) for buffering, frame storage, and local data processing.
- I/O Density — 310 user I/Os in the 672‑ball package to support complex multi-interface systems and external peripherals.
- High‑speed SERDES — Family-level embedded SERDES support up to 3.2 Gbps; the ECP3-35 in the 672 package is listed with 4 SERDES channels alongside 310 I/Os.
- DSP and Arithmetic Acceleration — ECP3 family sysDSP architecture provides cascaded DSP slices and multiply/accumulate resources for high-performance signal processing (family feature).
- Clocking and Timing — On-chip PLLs and DLLs (family feature) for flexible clock management and source‑synchronous interface support.
- Configurable I/O Standards — Programmable sysI/O buffer support for a wide range of I/O standards and optional on‑chip termination (family feature).
- Power — Core voltage specified between 1.14 V and 1.26 V with a nominal 1.2 V core supply on the ECP3 family.
- Package and Thermal — 672‑ball BGA (supplier package 672‑FPBGA, 27 × 27 mm) with industrial operating temperature from −40 °C to 100 °C.
- Standards & Tools — Device family includes system-level support such as IEEE 1149.1/1532 compatibility and configuration utilities (family feature).
- RoHS Compliant — Meets RoHS environmental requirements.
Typical Applications
- Communications Equipment — Implement protocol bridging, SERDES interfacing, and packet processing using on‑chip SERDES and DSP resources.
- Industrial Control — Deploy control logic, sensor aggregation, and deterministic I/O handling across wide temperature ranges using the industrial-grade device.
- Video and Imaging — Use embedded memory and DSP slices for frame buffering, pre-processing, and data formatting in video pipelines.
- Interface Aggregation — Consolidate multiple parallel and serial interfaces with the device’s high I/O count and programmable I/O buffers.
Unique Advantages
- Highly Integrated Mid‑Range FPGA: Combines 33,000 logic elements with ~1.36 Mbits of embedded RAM and 310 I/Os to reduce external component count.
- Flexible High‑Speed Connectivity: Family SERDES capability (up to 3.2 Gbps) and the 672‑ball package mapping enable multi‑channel serial links alongside abundant GPIO.
- Industrial Temperature Support: Qualified for −40 °C to 100 °C operation to meet demanding environmental requirements.
- Configurable I/O and Clocking: Programmable sysI/O buffers, on‑chip termination options, and multiple PLL/DLL resources help match diverse interface and timing needs.
- Proven Ecosystem: ECP3 family tooling and system features for configuration, debugging, and analysis streamline development and deployment.
Why Choose LFE3-35EA-8LFN672I?
The LFE3-35EA-8LFN672I positions itself as a versatile mid-range FPGA that balances programmable logic density, embedded memory, and high I/O count in a single industrial-grade package. It is suited to customers needing a scalable, integrated solution for communications, industrial control, and imaging applications where SERDES, DSP acceleration, and robust I/O are required.
Choosing this ECP3 device provides a combination of field-proven family features, industrial temperature capability, and a compact 672‑ball BGA package to help reduce board-level complexity while supporting a wide range of system interfaces.
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