LFE3-35EA-8FTN256I
| Part Description |
ECP3 Field Programmable Gate Array (FPGA) IC 133 1358848 33000 256-BGA |
|---|---|
| Quantity | 27 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FTBGA (17x17) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-BGA | Number of I/O | 133 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 4125 | Number of Logic Elements/Cells | 33000 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 1358848 |
Overview of LFE3-35EA-8FTN256I – ECP3 Field Programmable Gate Array (FPGA) IC 133 1358848 33000 256-BGA
The LFE3-35EA-8FTN256I is an ECP3 Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation, delivered in a 256-ball fine-pitch BGA package. It provides a combination of programmable logic, on-chip memory and a broad I/O count suited to industrial embedded applications.
With 33,000 logic elements, approximately 1.36 Mbits of embedded memory and 133 I/Os, this device targets systems that require moderate logic density, flexible I/O connectivity and industrial-grade operating range. The device operates from 1.14 V to 1.26 V and is specified for -40 °C to 100 °C operation.
Key Features
- Core Logic 33,000 logic elements for implementing custom digital functions and control logic.
- Embedded Memory Approximately 1.36 Mbits of on-chip RAM to support buffering, state machines and data storage without external memory.
- I/O Connectivity 133 user I/Os to interface with sensors, peripherals, communication transceivers and other system components.
- Power Narrow core supply range of 1.14 V to 1.26 V for predictable power provisioning and integration into regulated power domains.
- Package & Mounting 256-BGA (supplier package: 256-FTBGA 17×17) in a surface-mount package for compact board-level integration.
- Industrial Temperature Grade Rated for operation from -40 °C to 100 °C for deployments in industrial environments.
- Regulatory RoHS compliant, supporting lead-free assembly and regulatory requirements for many markets.
Typical Applications
- Industrial Control Deterministic control logic, sequence management and I/O aggregation in factory automation and process control systems.
- Embedded Communications Protocol bridging, packet processing and interface adaptation using available logic and I/O resources.
- Sensor Interfacing Aggregation and preprocessing of sensor data, including real-time filtering and state-machine-based signal conditioning.
- Custom Peripherals and Bridges Implement custom peripheral logic, timing-constrained interfaces or protocol converters within a compact BGA footprint.
Unique Advantages
- Balanced Logic and Memory: 33,000 logic elements coupled with ~1.36 Mbits of embedded RAM allows integrated implementation of control logic and local buffering without immediate need for external memory.
- Generous I/O Count: 133 I/Os enable flexible interfacing to multiple peripherals and sensors, reducing the need for additional I/O expanders.
- Industrial Temperature Range: Specified -40 °C to 100 °C operation makes the device suitable for typical industrial environments and outdoor enclosures.
- Compact, Surface-Mount Package: 256-FTBGA (17×17) delivers a high-density solution for space-constrained PCBs while maintaining robust ball-grid connections.
- Regulatory Compliance: RoHS compliance supports modern lead-free manufacturing processes and environmental requirements.
Why Choose LFE3-35EA-8FTN256I?
The LFE3-35EA-8FTN256I positions itself as a practical choice for industrial and embedded designs that require a mid-range FPGA with a solid mix of logic density, embedded memory and a high I/O count. Its operating voltage and industrial temperature rating support robust board-level integration into regulated power domains and temperature-varying environments.
Backed by Lattice Semiconductor Corporation, this device is suitable for teams building control systems, protocol bridges, sensor front-ends and custom peripherals that benefit from on-chip logic and memory in a compact package.
Request a quote or submit an inquiry to obtain pricing and availability for the LFE3-35EA-8FTN256I and evaluate it for your next industrial or embedded FPGA design.

Date Founded: 1983
Headquarters: Hillsboro, Oregon, USA
Employees: 1,000+
Revenue: $627.7 Million
Certifications and Memberships: ISO9001:2015, ISO14001:2015, IATF16949:2016