LFE3-35EA-8FTN256I

IC FPGA 133 I/O 256FTBGA
Part Description

ECP3 Field Programmable Gate Array (FPGA) IC 133 1358848 33000 256-BGA

Quantity 27 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package256-FTBGA (17x17)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case256-BGANumber of I/O133Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs4125Number of Logic Elements/Cells33000
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits1358848

Overview of LFE3-35EA-8FTN256I – ECP3 Field Programmable Gate Array (FPGA) IC 133 1358848 33000 256-BGA

The LFE3-35EA-8FTN256I is an ECP3 Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation, delivered in a 256-ball fine-pitch BGA package. It provides a combination of programmable logic, on-chip memory and a broad I/O count suited to industrial embedded applications.

With 33,000 logic elements, approximately 1.36 Mbits of embedded memory and 133 I/Os, this device targets systems that require moderate logic density, flexible I/O connectivity and industrial-grade operating range. The device operates from 1.14 V to 1.26 V and is specified for -40 °C to 100 °C operation.

Key Features

  • Core Logic 33,000 logic elements for implementing custom digital functions and control logic.
  • Embedded Memory Approximately 1.36 Mbits of on-chip RAM to support buffering, state machines and data storage without external memory.
  • I/O Connectivity 133 user I/Os to interface with sensors, peripherals, communication transceivers and other system components.
  • Power Narrow core supply range of 1.14 V to 1.26 V for predictable power provisioning and integration into regulated power domains.
  • Package & Mounting 256-BGA (supplier package: 256-FTBGA 17×17) in a surface-mount package for compact board-level integration.
  • Industrial Temperature Grade Rated for operation from -40 °C to 100 °C for deployments in industrial environments.
  • Regulatory RoHS compliant, supporting lead-free assembly and regulatory requirements for many markets.

Typical Applications

  • Industrial Control Deterministic control logic, sequence management and I/O aggregation in factory automation and process control systems.
  • Embedded Communications Protocol bridging, packet processing and interface adaptation using available logic and I/O resources.
  • Sensor Interfacing Aggregation and preprocessing of sensor data, including real-time filtering and state-machine-based signal conditioning.
  • Custom Peripherals and Bridges Implement custom peripheral logic, timing-constrained interfaces or protocol converters within a compact BGA footprint.

Unique Advantages

  • Balanced Logic and Memory: 33,000 logic elements coupled with ~1.36 Mbits of embedded RAM allows integrated implementation of control logic and local buffering without immediate need for external memory.
  • Generous I/O Count: 133 I/Os enable flexible interfacing to multiple peripherals and sensors, reducing the need for additional I/O expanders.
  • Industrial Temperature Range: Specified -40 °C to 100 °C operation makes the device suitable for typical industrial environments and outdoor enclosures.
  • Compact, Surface-Mount Package: 256-FTBGA (17×17) delivers a high-density solution for space-constrained PCBs while maintaining robust ball-grid connections.
  • Regulatory Compliance: RoHS compliance supports modern lead-free manufacturing processes and environmental requirements.

Why Choose LFE3-35EA-8FTN256I?

The LFE3-35EA-8FTN256I positions itself as a practical choice for industrial and embedded designs that require a mid-range FPGA with a solid mix of logic density, embedded memory and a high I/O count. Its operating voltage and industrial temperature rating support robust board-level integration into regulated power domains and temperature-varying environments.

Backed by Lattice Semiconductor Corporation, this device is suitable for teams building control systems, protocol bridges, sensor front-ends and custom peripherals that benefit from on-chip logic and memory in a compact package.

Request a quote or submit an inquiry to obtain pricing and availability for the LFE3-35EA-8FTN256I and evaluate it for your next industrial or embedded FPGA design.

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