LFE3-35EA-8FN484I

The LFE3-35EA-8FN484I is an ECP3 Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation. It combines a high logic element count with substantial on-chip RAM and a large I/O complement, making it suitable for complex programmable logic tasks.

Targeted for industrial-grade applications, this device offers low-voltage operation and an extended operating temperature range that supports deployment in environments requiring robust thermal tolerance and high I/O density.

Key Features

• Core  33,000 logic elements provide substantial programmable logic capacity for custom digital designs and hardware acceleration.
• Embedded Memory  Approximately 1.36 Mbits of on-chip RAM for buffering, packet storage, and local data processing without external memory.
• I/O Density  295 general-purpose I/Os enable broad peripheral connectivity and high-density interface aggregation directly on-chip.
• Power  Low-voltage core operation with a supply range of 1.14 V to 1.26 V to support power-conscious system designs.
• Package  484-ball BGA package (Supplier device package: 484-FPBGA, 23×23) designed for surface-mount assembly, supporting compact board layouts.
• Temperature & Reliability  Industrial-grade operation from −40 °C to 100 °C for use in temperature-challenging environments.
• Environmental Compliance  RoHS-compliant ordering ensures alignment with common environmental and manufacturing requirements.

Typical Applications

• Industrial Control and Automation  Use the industrial temperature range and robust I/O count to implement motor control, PLC logic, and factory automation interfaces.
• High‑Density Interface Aggregation  295 I/Os allow consolidation of multiple serial and parallel peripherals, reducing external glue logic and board complexity.
• Embedded Processing and Custom Logic  Combine 33,000 logic elements with on-chip RAM to implement custom data paths, protocol bridging, and real-time processing functions.

Unique Advantages

• High logic capacity: 33,000 logic elements enable substantial custom logic integration, reducing the need for multiple discrete devices.
• Substantial embedded memory: Approximately 1.36 Mbits of on-chip RAM supports local buffering and state storage for efficient data handling.
• Extensive I/O resources: 295 I/Os provide flexibility for complex interfacing tasks and dense connector or sensor arrays.
• Industrial temperature rating: Operation from −40 °C to 100 °C allows deployment in environments with wide temperature swings.
• Compact surface-mount BGA packaging: 484-ball BGA (484-FPBGA, 23×23) enables high-density PCB designs while supporting manufacturability.
• RoHS-compliant: Environmentally compliant manufacturing supports regulatory and supply-chain requirements.

Why Choose LFE3-35EA-8FN484I?

The LFE3-35EA-8FN484I is positioned for designs that require a blend of high logic density, ample embedded memory, and a large number of I/Os within an industrial temperature envelope. Its low-voltage operation and compact BGA packaging make it suitable for space-constrained systems that still demand significant programmable logic capability.

This device is well-suited for engineers designing robust, scalable systems such as industrial controllers, interface bridges, and embedded processing nodes where long-term reliability, integration, and predictable electrical characteristics are important.

Request a quote or submit a pricing inquiry for the LFE3-35EA-8FN484I to receive availability and ordering information tailored to your project requirements.