LFE3-35EA-8FTN256C

The LFE3-35EA-8FTN256C is a Lattice ECP3 family Field Programmable Gate Array (FPGA) in a 256-FTBGA (17 × 17 mm) package. It delivers 33,000 logic elements with approximately 1.36 Mbits of on-chip RAM, making it suitable for designs that require moderate logic density, flexible embedded memory, and a broad range of I/O connectivity.

Designed as part of the Lattice ECP3 family architecture, this device targets high-volume, high-speed, cost-sensitive applications where integration, I/O flexibility and low-voltage core operation are important. Key device-level attributes include 133 user I/Os, four SERDES channels in the 256-FTBGA package option, and commercial-grade operating temperature.

Key Features

• Core Logic  33,000 logic elements provide the programmable fabric for custom logic, control, and datapath functions.
• Embedded Memory  Approximately 1.36 Mbits of total on-chip RAM (Total Ram Bits: 1,358,848) for embedded buffering, FIFOs and state storage.
• DSP and Multipliers (family-level)  ECP3-35 devices include 64 18×18 multipliers for efficient multiply–accumulate and DSP operations within the family architecture.
• High-speed Serial and Parallel I/O  133 user I/Os with the 256-FTBGA package offering four SERDES channels (family package mapping), enabling mixed parallel and serialized interfaces.
• Clocking Resources (family-level)  Dedicated PLLs and DLLs are included in the ECP3 family (ECP3-35 devices provide 4 PLLs and 2 DLLs) to support flexible clock management.
• Power and Packaging  Core supply voltage range 1.14 V to 1.26 V, surface-mount 256-FTBGA package (17 × 17 mm) for compact board integration.
• Commercial Operating Range & Compliance  Commercial temperature grade (0 °C to 85 °C) and RoHS compliant for standard commercial product deployments.

Typical Applications

• Telecommunications and Networking  Use for protocol handling, packet buffering and serialization/deserialization where ECP3 family SERDES and I/O flexibility support interfaces such as Ethernet and other serial links.
• Video and Broadcast  Implements data formatting, timing and interface functions for broadcast and SMPTE-related workflows leveraging DSP and I/O features.
• Industrial and Test Equipment  Provides on-board processing, control logic and mixed-signal interfacing for high-volume instrumentation and data acquisition systems within commercial temperature ranges.
• Memory and Interface Bridging  Acts as a programmable bridge or controller for DDR/parallel interfaces and custom timing domains using embedded RAM and clocking resources.

Unique Advantages

• Balanced Logic and Memory  33,000 logic elements paired with approximately 1.36 Mbits of embedded RAM enable consolidated logic + buffering inside a single FPGA.
• Packaged for Compact Boards  256-FTBGA (17 × 17 mm) provides a dense footprint for space-constrained designs while exposing 133 user I/Os for system connectivity.
• SerDes-Enabled I/O  Four SERDES channels available in the 256-FTBGA package option allow designers to combine parallel I/O with multi‑Gbps serial links at the device-family level.
• Low-Voltage Core Operation  Narrow core supply range (1.14 V to 1.26 V) supports designs optimized for low-voltage FPGA cores and consistent power rail planning.
• Commercial-Grade Reliability  Specified for 0 °C to 85 °C operation and RoHS compliant, meeting typical commercial production requirements.
• Ecosystem and Family-Level Features  As part of the Lattice ECP3 family, the device benefits from family-level capabilities such as sysDSP slices, flexible memory architecture and on-chip clocking primitives for system-level design scaling.

Why Choose LFE3-35EA-8FTN256C?

The LFE3-35EA-8FTN256C positions itself as a pragmatic FPGA choice for commercial applications that need a balanced blend of logic density, embedded memory, and flexible I/O in a compact BGA package. Its ECP3 family architecture provides DSP-friendly resources, configurable clocking, and SERDES-enabled interfaces that help consolidate functions onto a single programmable device.

This part is suitable for designers seeking a cost-conscious, production-ready FPGA solution for networking, video, industrial instrumentation and interface bridging where a 0 °C to 85 °C operating range, RoHS compliance and compact board integration are required. The device benefits from the broader ECP3 family tooling and architecture for scalable designs and system-level reuse.

Request a quote or submit an inquiry to get pricing and availability for LFE3-35EA-8FTN256C.