LFE3-35EA-8LFN672C

The LFE3-35EA-8LFN672C is a Lattice ECP3 family Field Programmable Gate Array (FPGA) supplied in a 672-FPBGA (27 × 27 mm) package. It delivers approximately 33,000 logic elements, around 1.36 Mbits of on-chip RAM and 310 user I/Os, making it suitable for mid-density, performance-oriented system integration in commercial applications. As a member of the ECP3 family, it combines enhanced DSP capabilities, flexible memory resources and high-speed SERDES/I/O support for applications requiring a balance of logic, embedded memory and I/O density.

Key Features

• Core Logic  Approximately 33,000 logic elements (LUT-based fabric) suitable for complex glue-logic, protocol handling and control functions.
• Embedded Memory  Approximately 1.36 Mbits of on-chip RAM (Total Ram Bits: 1,358,848) for FIFOs, buffers and state storage.
• High I/O Count  310 user I/Os in the 672-FPBGA package to support wide parallel interfaces and multiple peripheral connections.
• SERDES  672-FPBGA package supports four SERDES channels; family SERDES data rates range from 150 Mbps to 3.2 Gbps for high-speed serial links.
• sysDSP and Multipliers  Enhanced sysDSP architecture with dedicated multiply-accumulate structures; device-level support includes 64 18×18 multipliers for DSP and signal-processing tasks.
• Clocking and Timing  Multiple PLLs and DLLs (ECP3-35 shows 4 PLLs / 2 DLLs in family documentation) to support clock management and source-synchronous interfaces.
• Package and Mounting  672-FPBGA (27 × 27 mm) in tray packaging, surface-mount footprint for standard PCB assembly processes.
• Power and Temperature  Specified voltage supply 1.14 V and operating temperature range 0 °C to 85 °C (commercial grade).

Typical Applications

• High-speed Networking  Use the on-chip SERDES and high I/O count for bridging, protocol conversion and packet processing in Ethernet, backplane or telecom interface modules.
• Digital Signal Processing  Leverage the sysDSP slices and 18×18 multipliers for mid-range DSP workloads such as filtering, codec front-ends and real-time data processing.
• Embedded Systems and Control  Deploy as system glue logic and peripheral interface controller where compact on-chip RAM and plentiful I/Os simplify board-level integration.
• Video and Broadcast Interfaces  Implement source-synchronous and high-speed serial interfaces supported by the family SERDES for video transport and protocol bridging.

Unique Advantages

• Balanced Integration: Combines ~33k logic elements, ~1.36 Mbits RAM and 310 I/Os in a single 672-FPBGA package to reduce external components and PCB complexity.
• High-speed Serial Capability: Four SERDES channels at up to 3.2 Gbps (family specification) enable compact implementations of high-bandwidth links.
• Dedicated DSP Resources: Built-in multipliers and sysDSP architecture speed development of signal-processing functions without large external DSP arrays.
• Flexible Clocking: Multiple PLLs/DLLs (family-level 4 PLLs / 2 DLLs for ECP3-35) allow precise clock management for multi-domain designs.
• Commercial-grade Reliability: Specified for 0 °C to 85 °C operation and surface-mount packaging suited for mainstream commercial products.

Why Choose LFE3-35EA-8LFN672C?

The LFE3-35EA-8LFN672C places a practical mix of logic, embedded memory and I/O density into a compact 672-FPBGA package. It is well suited for commercial systems that require moderate DSP performance, multiple high-speed interfaces and a high pin count without moving to larger, higher-cost devices. As part of the Lattice ECP3 family, it benefits from architecture optimized for DSP and serial connectivity while providing device-level resources that simplify system design and reduce BOM.

Designers and product teams targeting networking, video, embedded control or mid-range signal-processing applications will find this device useful where a combination of logic capacity, on-chip RAM and high I/O count are primary requirements.

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