LFE3-35EA-8LFTN256C

The LFE3-35EA-8LFTN256C is a Lattice ECP3 family Field Programmable Gate Array (FPGA) supplied in a 256-FTBGA surface-mount package (17 × 17 mm). It offers 33,000 logic elements and approximately 1.36 Mbits of on-chip RAM, with 133 user I/Os and embedded high-speed SERDES capabilities as described in the ECP3 family data sheet.

Designed for cost-sensitive, high-density designs, this commercial-grade device targets applications that require a balance of DSP capability, flexible I/O standards and embedded memory while operating from a 1.14 V to 1.26 V core supply and a 0 °C to 85 °C temperature range.

Key Features

• Core Logic  33,000 logic elements suitable for mid-range integration of combinational and sequential logic.
• On-chip Memory  Approximately 1.36 Mbits of embedded RAM to support buffering, packet handling and local data storage.
• High-speed SERDES and Interfaces  Family-level support for embedded SERDES with data rates up to 3.2 Gbps and support for protocols including PCI Express, Ethernet (1GbE, SGMII, XAUI), SONET/SDH, CPRI and SMPTE 3G as described in the ECP3 data sheet.
• sysDSP and Multiply/Accumulate  ECP3 family sysDSP slice architecture provides hardware multiply‑accumulate resources for signal processing and algorithm acceleration.
• Flexible sysI/O Buffering  Programmable I/O with a wide range of parallel and differential standards (LVTTL, LVCMOS, LVDS, SSTL, HSTL, LVPECL and others per family documentation) and on‑chip termination options.
• Configuration and System Features  Family-level configuration options include SPI boot flash interface, dual-boot images and soft error detect macros; on-chip oscillator and multiple PLL/DLL resources are available per device family documentation.
• Package and Mounting  256-ball fine-pitch BGA (256-FTBGA, 17 × 17 mm) surface-mount package for compact board-level integration.
• Power and Temperature  Core supply range 1.14 V to 1.26 V; commercial operating range 0 °C to 85 °C. RoHS compliant.

Typical Applications

• High-speed Communications  Implements SERDES-based links and protocol bridging for interfaces such as PCIe, 1GbE, XAUI, CPRI and SONET/SDH.
• Signal Processing and Video  sysDSP slices and embedded RAM support filtering, transforms and video processing tasks including SMPTE 3G workflows.
• Network and Packet Processing  On-chip memory and flexible I/O enable packet buffering, classification and custom network offload functions.
• Embedded System Glue Logic  Integrates custom peripheral interfaces, clocking and configuration functions in compact, surface-mount form factors.

Unique Advantages

• Balanced mid-range capacity: 33,000 logic elements and ~1.36 Mbits of RAM provide an efficient footprint for complex mid-density designs without excessive cost or board area.
• High-speed serial support: Embedded SERDES and family-level protocol support let designers implement multi-gigabit links and standard serial interfaces.
• Flexible I/O standards: Wide-ranging programmable I/O options reduce external level-shifter and transceiver requirements, simplifying BOM and board layout.
• Compact package: 256-FTBGA (17 × 17 mm) surface-mount package enables dense board integration for space-constrained designs.
• Commercial temperature and RoHS compliance: Suitable for mainstream commercial applications with industry‑standard environmental and manufacturing compliance.
• Configurable system features: On-chip clocking, SPI configuration support and dual-boot options improve system flexibility and field update capability.

Why Choose LFE3-35EA-8LFTN256C?

The LFE3-35EA-8LFTN256C positions itself as a practical mid-range FPGA for designers who need a combination of DSP resources, embedded memory and high-speed serial connectivity in a compact BGA package. Its 33,000 logic elements and approximately 1.36 Mbits of on-chip RAM make it well suited for communications, video and embedded processing tasks where board space, I/O flexibility and protocol support matter.

Backed by the ECP3 family architecture and configuration features documented in the data sheet, this device provides a scalable option for teams seeking predictable performance, flexible configuration and a reduced external BOM in commercial-grade applications.

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