LFE3-35EA-7LFTN256I

The LFE3-35EA-7LFTN256I is an ECP3 family FPGA from Lattice Semiconductor. It provides a reconfigurable FPGA fabric with 33,000 logic elements and family-level capabilities such as embedded SERDES, sysDSP architecture, and flexible memory and I/O resources.

This device targets applications requiring moderate logic density, substantial on-chip memory and a broad set of I/O options. Its industrial-grade qualification, extended temperature range, and 256-FTBGA package make it suitable for embedded and industrial designs where integration and predictable electrical characteristics matter.

Key Features

• Logic Capacity  Approximately 33,000 logic elements for implementing control, glue logic, DSP functions and custom state machines.
• Embedded Memory  Approximately 1.36 Mbits of total on-chip RAM to support buffering, lookup tables and small embedded data stores.
• High‑Density I/O  133 user I/Os in the 256-FTBGA package, enabling wide peripheral and bus connectivity.
• Embedded SERDES (Family Feature)  ECP3 family SERDES support for serial protocols and multi-gigabit channels; the 256-FTBGA package is associated with 4 SERDES channels and 133 I/Os per the family data.
• sysDSP and Arithmetic Resources (Family Feature)  Enhanced sysDSP slice architecture and dedicated multiplier resources available in the ECP3 family for efficient multiply-accumulate operations.
• Clock Management (Family Feature)  On-chip PLLs and DLLs available in the ECP3 family to support clock generation and deskewing for system timing.
• Package and Mounting  256-FTBGA (17 × 17 mm) surface-mount package for compact board-level integration.
• Power Supply  Core voltage supply range of 1.14 V to 1.26 V, accommodating typical FPGA core power rails.
• Industrial Temperature Grade  Specified operating temperature from −40 °C to 100 °C for industrial-environment deployment.
• Environmental Compliance  RoHS compliant.

Typical Applications

• High‑speed communications  Use embedded SERDES and the ECP3 family’s serial protocol support for networking equipment, media transport and protocol bridging.
• Memory interface and buffering  Leverage on-chip RAM and dedicated memory interfaces for DDR/DDR2/DDR3 buffering and controller logic in embedded systems.
• Industrial control  Deploy in automation and control systems that require industrial temperature range and flexible I/O for sensor, actuator and fieldbus interfaces.
• Video and broadcast processing  Apply the device’s DSP slices and I/O flexibility for SMPTE 3G and other broadcast-oriented serial interfaces supported by the ECP3 family.

Unique Advantages

• Balanced logic and memory  33,000 logic elements combined with approximately 1.36 Mbits of embedded memory support mixed logic and data buffering within a single device.
• Compact, board-friendly package  256-FTBGA (17 × 17 mm) provides a high pin-count solution in a compact footprint for space-constrained PCBs.
• Industrial-grade operating range  Rated for −40 °C to 100 °C, enabling deployment in harsher environmental conditions common to industrial applications.
• Flexible I/O and SERDES support  A high I/O count and family-level SERDES capabilities simplify integration with high-speed peripherals and serial links.
• Precise core voltage specification  A defined core supply range of 1.14 V to 1.26 V assists in power-supply design and system-level validation.
• Regulatory and environmental readiness  RoHS compliance supports regulatory requirements for many commercial and industrial applications.

Why Choose LFE3-35EA-7LFTN256I?

The LFE3-35EA-7LFTN256I positions itself as a versatile mid-density FPGA solution within the Lattice ECP3 family, combining 33,000 logic elements, substantial on-chip RAM and 133 I/Os in a compact 256-FTBGA package. Its family-level features—such as embedded SERDES, sysDSP slices and clock-management resources—make it suitable for designs that need a balance of logic, memory and serial connectivity while maintaining industrial temperature operation.

This device is a practical choice for engineering teams building embedded communications, industrial control, memory-interface and broadcast-processing systems that require a predictable component footprint, defined electrical characteristics and vendor-supported family features.

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