LFE3-35EA-7LFTN256C
| Part Description |
ECP3 Field Programmable Gate Array (FPGA) IC 133 1358848 33000 256-BGA |
|---|---|
| Quantity | 1,414 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FTBGA (17x17) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-BGA | Number of I/O | 133 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 4125 | Number of Logic Elements/Cells | 33000 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 1358848 |
Overview of LFE3-35EA-7LFTN256C – ECP3 FPGA, 33,000 logic elements, 256‑BGA
The LFE3-35EA-7LFTN256C is a Lattice Semiconductor ECP3 family field programmable gate array (FPGA) in a 256‑ball FTBGA package. It delivers 33,000 logic elements and flexible on-chip memory in a compact, surface‑mount package for commercial applications requiring high integration and low‑voltage operation.
Designed for mid‑range logic and high‑speed I/O integration, this device targets applications that need a balance of DSP capability, embedded memory and multi‑lane serial interfaces while operating within a 1.14 V to 1.26 V core supply range and a 0 °C to 85 °C commercial temperature window.
Key Features
- Core Logic — 33,000 logic elements provide substantial LUT capacity for mid‑range FPGA designs and system integration.
- Embedded Memory — Approximately 1.36 Mbits of on‑chip RAM (total RAM bits: 1,358,848) for frame buffering, FIFOs and state storage.
- High‑Speed I/O — Up to 133 user I/Os supported in the 256‑FTBGA (17×17 mm) package, enabling broad interface flexibility.
- SERDES Capability — Supports up to 4 SERDES channels (quad) in the 256‑FTBGA package for multi‑lane serial protocols and high‑speed links.
- DSP and Arithmetic — ECP3 family sysDSP architecture (as described in the family datasheet) for multiply‑accumulate and high‑performance arithmetic operations.
- Flexible Configuration & System Support — Family features include dual‑boot images, SPI boot flash interface and on‑chip oscillator; system utilities and debug support are provided for development.
- Package & Mounting — 256‑BGA (256‑FTBGA, 17×17 mm) surface‑mount package for compact board-level integration.
- Power & Temperature — Core voltage range 1.14 V to 1.26 V; commercial operating temperature range 0 °C to 85 °C.
- Regulatory — RoHS compliant, supporting lead‑free manufacturing processes.
Typical Applications
- High‑Speed Serial Connectivity — Implement multi‑lane SERDES links such as PCI Express or Ethernet physical interfaces using available quad SERDES channels and abundant I/Os.
- Video and Broadcast Processing — Use the device’s DSP resources and embedded memory for video frame buffering, formatting and SMPTE‑3G interface handling.
- Communications & Radio Infrastructure — Deployable in CPRI and other telecom link designs that require deterministic DSP and serial link support.
- Industrial and Commercial Control — Suitable for mid‑range control, sensor aggregation and protocol bridging within the specified commercial temperature range.
Unique Advantages
- Balanced Logic and Memory: 33,000 logic elements combined with approximately 1.36 Mbits of embedded memory enables complex control and buffering without immediate need for external RAM.
- Compact, High‑I/O Package: 256‑FTBGA (17×17 mm) offers 133 I/Os and quad SERDES capability in a space‑efficient footprint for dense PCBs.
- Low‑Voltage Core: Operates within a narrow 1.14 V–1.26 V supply window to match modern low‑voltage power architectures.
- Commercial‑Grade Reliability: Rated for 0 °C to 85 °C operation and RoHS compliant for production environments targeting consumer and commercial systems.
- System Development Support: Family‑level features include flexible configuration options and on‑chip utilities to streamline prototyping and field updates.
Why Choose LFE3-35EA-7LFTN256C?
The LFE3-35EA-7LFTN256C positions itself as a mid‑range member of the Lattice ECP3 family that combines a sizable logic fabric with meaningful embedded memory and multi‑lane serial I/O capability in a compact 256‑BGA package. Its combination of DSP resources, SERDES channels and 133 I/Os makes it well suited for designers who need integrated serial connectivity and local memory for buffering or compute tasks without stepping up to larger, higher‑cost devices.
This device is appropriate for commercial applications where board space, power efficiency and integrated system features matter. It provides a clear upgrade path within the ECP3 family for designs that may scale in logic or I/O requirements while benefiting from documented family architecture and development support.
Request a quote or submit a pricing enquiry to get availability and lead‑time details for the LFE3-35EA-7LFTN256C. Our team can provide ordering information and help match this FPGA to your project requirements.