LFE3-35EA-7LFN672I

The LFE3-35EA-7LFN672I is a member of the LatticeECP3 family of Field Programmable Gate Arrays (FPGAs) from Lattice Semiconductor Corporation. This device combines a mid-range logic fabric with on-chip embedded memory and high-density I/O in a 672-FPBGA (27 × 27 mm) package, targeting industrial and high-performance embedded applications.

Designed for system integration and flexible serial/parallel interfacing, the device is suitable for applications that require substantial logic capacity, moderate embedded memory, and up to 310 user I/Os while operating across an industrial temperature range.

Key Features

• Core Logic Approximately 33,000 logic elements provide the primary programmable fabric for control, glue logic, and medium-complexity algorithm implementation.
• Embedded Memory Approximately 1.36 Mbits of on-chip RAM (total RAM bits: 1,358,848) for code storage, buffering, and local data structures.
• I/O and Package Up to 310 user I/Os in a 672-FPBGA (27 × 27 mm) surface-mount package; supplied in tray format for board-level assembly.
• Operating Range Industrial-grade device with an operating temperature range of −40 °C to 100 °C and a core supply voltage of 1.14 V.
• High-speed Serial and Protocol Support (Family Capabilities) The LatticeECP3 family includes embedded SERDES supporting data rates from 150 Mbps to 3.2 Gbps and commonly used serial protocols (family-level capability listed in the ECP3 datasheet).
• sysDSP and Multipliers (Family Capability) Enhanced sysDSP slice architecture and dedicated multipliers available in the ECP3 family for multiply–accumulate and high-performance math operations.
• Clock and Timing Resources (Family Capability) Multiple PLLs and DLLs are available in the ECP3 family for flexible clocking and timing control; ECP3-35 devices provide PLLs/DLLs to support diverse timing requirements.
• Flexible Configuration and System Tools (Family Capability) Family-level configuration features include SPI boot flash interface, dual-boot images, soft error detect macros, and compliance with IEEE 1149.1 and IEEE 1532 for board-level configuration and debug utilities.

Typical Applications

• High-speed communications — FPGA fabric and family SERDES capabilities support implementations of serial protocols and packet-processing logic for networking equipment and data links.
• Embedded signal processing — sysDSP slices and on-chip multipliers (family capabilities) enable filtering, accumulation, and other DSP tasks in instrumentation and communications gear.
• Memory and interface bridging — On-chip RAM and abundant I/O count make the device suitable for buffering, protocol conversion, and peripheral interface consolidation.
• Industrial control and automation — Industrial temperature rating and surface-mount packaging allow deployment in factory automation, motor control front-ends, and rugged embedded controllers.

Unique Advantages

• Balanced logic and memory — ~33,000 logic elements combined with ~1.36 Mbits of embedded RAM provide a practical balance for mid-density designs that need both logic capacity and local storage.
• High I/O density in a compact package — 310 user I/Os in a 672-FPBGA (27 × 27 mm) package supports board designs that need many parallel signals without a larger footprint.
• Industrial-grade thermal range — −40 °C to 100 °C operating range supports deployment in thermally challenging industrial environments.
• Flexible configuration options — Family-level SPI boot, dual-boot, and configuration utilities enable robust field update and system management strategies.
• Family-level high-speed serial and DSP features — Access to ECP3 family SERDES, sysDSP, and timing resources lets designers leverage pre-engineered building blocks for high-performance tasks.

Why Choose LFE3-35EA-7LFN672I?

The LFE3-35EA-7LFN672I positions itself as a mid-density FPGA option within the LatticeECP3 family that blends substantial logic capacity, measurable on-chip memory, and high I/O density in a compact, industrial-rated package. It is well suited for customers building embedded systems that require integrated logic, local buffering, and flexible I/O while operating across a wide temperature range.

By leveraging the LatticeECP3 family capabilities—such as embedded SERDES, sysDSP primitives, and comprehensive configuration options—designers can scale functionality and accelerate time-to-market using a proven FPGA architecture and system-level tools referenced in the ECP3 documentation.

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