LFE3-35EA-7FTN256C

The LFE3-35EA-7FTN256C is an ECP3 family FPGA from Lattice Semiconductor offering a mid-range programmable logic solution in a 256-ball BGA package. It provides 33,000 logic elements and approximately 1.36 Mbits of embedded RAM, with 133 user I/O pins for interfacing and system integration.

Designed for commercial-grade applications, this surface-mount FPGA operates from a 1.14 V to 1.26 V core supply and across a 0 °C to 85 °C operating range. Its combination of logic capacity, on-chip memory, and moderate I/O count makes it suitable for designs that require flexible, reprogrammable digital logic in a compact package.

Key Features

• Core Logic 33,000 logic elements provide programmable resources for custom logic, control, and data-path implementations.
• Embedded Memory Approximately 1.36 Mbits of on-chip RAM for buffering, FIFOs, and localized storage to support mid-range designs.
• I/O Count 133 general-purpose I/O pins support a variety of external interfaces and peripheral connections.
• Power Core voltage supply range of 1.14 V to 1.26 V for integration with standard low-voltage power domains.
• Package & Mounting 256-ball BGA package (supplier package: 256-FTBGA, 17×17) optimized for surface-mount assembly in compact system designs.
• Operating Conditions Commercial-grade device with an operating temperature range of 0 °C to 85 °C.
• Environmental Compliance RoHS-compliant to support lead-free manufacturing processes.

Typical Applications

• Mid-range embedded systems Use the programmable logic capacity and on-chip RAM for control, protocol handling, and custom processing tasks.
• I/O-intensive interface bridging Leverage 133 I/Os to connect sensors, peripherals, or multiple serial/parallel interfaces within compact designs.
• Compact, surface-mount modules The 256-BGA package suits small form-factor boards requiring surface-mount assembly and moderate logic capacity.

Unique Advantages

• Balanced logic and memory: 33,000 logic elements combined with ~1.36 Mbits of RAM enable a mix of control logic and data buffering without external memory for many applications.
• Moderate I/O density: 133 I/Os simplify integration with a wide range of peripherals while keeping board routing manageable.
• Compact package: 256-ball BGA (256-FTBGA, 17×17) supports high-density placement and small PCB footprints.
• Commercial operating range: Rated 0 °C to 85 °C for typical commercial environments and product deployments.
• RoHS compliant: Meets lead-free assembly requirements for modern manufacturing flows.

Why Choose LFE3-35EA-7FTN256C?

The LFE3-35EA-7FTN256C offers a practical combination of logic resources, embedded memory, and I/O capacity in a compact BGA package for commercial-grade FPGA applications. Its specification set—33,000 logic elements, approximately 1.36 Mbits of on-chip RAM, 133 I/Os, and a 1.14–1.26 V core supply—makes it well suited to designs that need reprogrammable logic, moderate data buffering, and flexible interfacing in constrained board space.

This device is a fit for engineers and teams developing mid-range programmable solutions where predictable commercial operating conditions, surface-mount packaging, and RoHS compliance are required.

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