LFE3-35EA-7FN672I
| Part Description |
ECP3 Field Programmable Gate Array (FPGA) IC 310 1358848 33000 672-BBGA |
|---|---|
| Quantity | 527 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 672-FPBGA (27x27) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 672-BBGA | Number of I/O | 310 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 4125 | Number of Logic Elements/Cells | 33000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 1358848 |
Overview of LFE3-35EA-7FN672I – ECP3 Field Programmable Gate Array (FPGA) IC 310 1358848 33000 672-BBGA
The LFE3-35EA-7FN672I is an ECP3 series Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation configured in a 672-ball BGA package. It provides a mid-range programmable logic resource set with 33,000 logic elements, approximately 1.36 Mbits of embedded RAM, and 310 user I/O pins to support diverse FPGA designs.
Built for surface-mount PCB assemblies and rated for industrial operation, this device supports single-supply core voltages between 1.14 V and 1.26 V and an operating temperature range of -40 °C to 100 °C.
Key Features
- Logic Capacity — 33,000 logic elements to implement mid-range programmable logic networks and custom digital functions.
- Embedded Memory — Approximately 1.36 Mbits of on-chip RAM (1,358,848 bits) for buffering, state storage, and small on-chip datasets.
- I/O Resources — 310 general-purpose I/O pins to support wide external interfacing and parallel signal requirements.
- Power — Core voltage supply range of 1.14 V to 1.26 V to match low-voltage system domains.
- Package & Mounting — 672-ball BGA (supplier package: 672-FPBGA, 27×27) in a surface-mount form factor for compact board integration.
- Industrial Temperature Grade — Rated for operation from -40 °C to 100 °C to meet industrial environmental requirements.
Unique Advantages
- Balanced logic and memory — The combination of 33,000 logic elements and ~1.36 Mbits of embedded RAM supports integrated implementations without immediate need for large external memory.
- High I/O count — 310 I/Os enable complex interfacing scenarios and multiple parallel connections to peripherals and external devices.
- Compact BGA footprint — 672-ball FPBGA (27×27) package allows dense board layouts while providing robust signal pinout.
- Industrial temperature range — Specified -40 °C to 100 °C operation for designs targeting industrial environments.
- Low-voltage core operation — Narrow 1.14–1.26 V supply window simplifies core power-domain planning in low-voltage systems.
Why Choose LFE3-35EA-7FN672I?
The LFE3-35EA-7FN672I offers a practical balance of programmable logic, embedded memory, and I/O resources in an industrial-grade package suitable for mid-range FPGA implementations. Its specification set — 33,000 logic elements, ~1.36 Mbits of RAM, 310 I/Os, and a 672-ball BGA package — targets designs that require significant on-chip resources within a compact surface-mount form factor.
This device is appropriate for teams and projects that need predictable power requirements (1.14–1.26 V core supply) and operation across an industrial temperature range, while maintaining a high I/O count for system integration and interfacing.
Request a quote or submit an inquiry to obtain pricing, availability, and lead-time details for LFE3-35EA-7FN672I.
