LFE3-35EA-6LFTN256I

The LFE3-35EA-6LFTN256I is an ECP3 family Field Programmable Gate Array (FPGA) in a compact 256-FTBGA (17×17 mm) package. It delivers approximately 33,000 logic elements with roughly 1.36 Mbits of on-chip RAM and 133 user I/Os, making it suitable for industrial embedded applications requiring mid-range logic capacity and flexible I/O connectivity.

Built on the Lattice ECP3 architecture, this device combines reconfigurable logic, dedicated DSP resources, multi-rate serial interfaces and configurable I/O standards to address high-speed communications, signal processing and system integration requirements while operating across industrial temperature and supply ranges.

Key Features

• Logic Capacity — Approximately 33,000 logic elements for implementing mid-density control, protocol and signal-processing functions.
• Embedded Memory — Approximately 1.36 Mbits of total on-chip RAM to store buffers, FIFOs and local data structures.
• I/O and Package — 133 user I/Os in a 256-FTBGA (17×17 mm) surface-mount package for compact board-level integration.
• SERDES and High‑Speed Interfaces — ECP3 family embedded SERDES capable of multi-rate operation (up to 3.2 Gbps per channel as supported by the family) and support for up to four SERDES channels in the 256-FTBGA package.
• DSP and Arithmetic Resources — Family-level sysDSP architecture and dedicated multipliers provide scalable multiply-accumulate support for signal-processing tasks.
• Clocking and Timing — Multiple PLLs and DLLs available (ECP3-35 family supports up to four PLLs and two DLLs) for flexible clock management and interface timing.
• Configurable I/O Standards — Programmable I/O buffer support across a wide range of single‑ended and differential standards for memory, serial and parallel interfaces.
• Industrial Temperature Grade — Rated to operate from −40°C to 100°C for industrial environments.
• Core Supply Range — 1.14 V to 1.26 V core voltage supply.
• Surface-Mount Package — 256-BGA surface-mount package (supplier device package 256-FTBGA) for reliable assembly and dense PCB layouts.
• Standards and Tools (Family Support) — Family-level system features including configuration utilities, logic analysis and embedded configuration options to streamline development and field updates.

Typical Applications

• Communications Infrastructure — Implement protocol bridging, packet processing and multi-rate serial interfaces (PCIe, Ethernet, CPRI, Serial RapidIO) using the device’s SERDES and flexible I/O.
• Video and Broadcast Systems — Support SMPTE‑level video interfaces and high-speed ADC/DAC front ends with dedicated DSP resources and source-synchronous I/O features.
• Industrial Control and Automation — Use the FPGA for motor control, sensor aggregation and deterministic I/O handling across an industrial temperature range.
• Test & Measurement — Leverage on-chip RAM, DSP slices and configurable clocks for data acquisition, buffering and real-time processing tasks.

Unique Advantages

• Balanced mid-range logic and memory: Approximately 33,000 logic elements and ~1.36 Mbits of embedded RAM give designers headroom for control, buffering and mid-complexity algorithms without excessive board-level components.
• Compact, board-friendly package: 256-FTBGA (17×17 mm) provides 133 I/Os and up to four SERDES channels in a small footprint for space-constrained designs.
• Industrial-ready operation: Rated for −40°C to 100°C to meet the needs of industrial deployments and harsh environments.
• Flexible high-speed connectivity: Family SERDES support and programmable I/O standards enable integration with diverse high-speed serial and parallel peripherals.
• On-chip clocking and DSP resources: Multiple PLLs/DLLs and sysDSP capabilities simplify timing control and accelerate signal-processing implementations.
• Low-voltage core operation: 1.14 V to 1.26 V core supply range supports designs targeting lower core power consumption.

Why Choose LFE3-35EA-6LFTN256I?

The LFE3-35EA-6LFTN256I positions itself as a capable mid-density FPGA that balances logic, embedded memory and I/O flexibility in a compact industrial-grade package. It is well-suited for embedded system designs that require multi-rate serial interfaces, DSP acceleration and robust I/O options without stepping up to larger, higher-cost devices.

Design teams targeting communications, video, industrial control or test-and-measurement applications will find this ECP3-based device offers a pragmatic mix of performance and integration, backed by the family-level configuration and analysis features that simplify prototyping and field updates.

Request a quote or submit a pricing inquiry to evaluate LFE3-35EA-6LFTN256I for your next design.