LFE3-35EA-6LFN484I

The LFE3-35EA-6LFN484I is an ECP3 family FPGA from Lattice Semiconductor, providing a reconfigurable SRAM-based fabric optimized for high-performance logic and system integration. This device combines approximately 33,000 logic elements with flexible embedded memory and a broad set of I/O and on-chip system resources.

Targeted at high-speed, high-volume designs, the device suits applications that require moderate logic density, significant on-chip memory (approximately 1.36 Mbits), and extensive I/O connectivity (295 user I/Os). Key on-chip characteristics include family-level support for high-speed SERDES, sysDSP processing slices, PLL/DLL clocking, and configurable I/O standards.

Key Features

• Logic Capacity  Approximately 33,000 logic elements for implementing complex combinational and sequential logic functions.
• Embedded Memory  Approximately 1.36 Mbits of on-chip RAM to support data buffering, FIFOs, and local storage.
• I/O and Packaging  295 user I/Os in a 484-ball FBGA package (484-BBGA / 484-FPBGA, 23 × 23 mm), delivered in a surface-mount form factor.
• High-speed Serial and Source-Synchronous I/O (Family Capability)  ECP3 family supports embedded SERDES and pre‑engineered source synchronous interfaces for high-speed serial links and memory interfaces (family-level capability documented in the datasheet).
• sysDSP and Arithmetic Resources (Family Capability)  Enhanced DSP slice architecture in the ECP3 family for multiply-accumulate operations and high-performance arithmetic (family-level feature).
• Clocking and Timing  Multiple PLLs and DLLs are supported in the ECP3 family to enable versatile clock management (family-level feature).
• Power  Core voltage supply range: 1.14 V to 1.26 V.
• Industrial Temperature Range  Rated for operation from -40 °C to 100 °C.
• Regulatory  RoHS compliant.

Typical Applications

• High-speed serial connectivity  Implements protocol bridging and serialization/deserialization functions using the family’s SERDES and source-synchronous I/O capabilities.
• Communications infrastructure  Suitable for baseband processing, fronthaul/backhaul interfaces, and protocol conversion in network equipment that requires moderate logic and embedded memory.
• Video and broadcast transport  Supports video transport and processing pipelines leveraging high-speed I/O and on-chip memory for buffering and alignment.
• Embedded signal processing  On-chip sysDSP slices and embedded RAM enable FIR/IIR filters, ADC/DAC interfacing, and other DSP tasks (family-level DSP resources).

Unique Advantages

• Balanced logic and memory  Approximately 33,000 logic elements paired with ~1.36 Mbits of embedded memory provides a balanced platform for control, protocol, and data-path functions.
• High I/O count in compact package  295 I/Os in a 484-ball FBGA (23 × 23 mm) reduce board-level routing complexity while enabling dense system integration.
• Industrial temperature rating  -40 °C to 100 °C operation supports deployment in a wide range of environmental conditions.
• Low-voltage core  1.14 V to 1.26 V core supply aligns with modern power-optimized system designs.
• Ecosystem and family features  Built on the Lattice ECP3 family architecture, the device benefits from family-level features such as SERDES, sysDSP, PLL/DLL resources, and configuration support documented in the datasheet.
• RoHS compliance  Meets standard environmental requirements for lead-free assembly processes.

Why Choose LFE3-35EA-6LFN484I?

The LFE3-35EA-6LFN484I positions itself as a versatile mid-range FPGA option within the Lattice ECP3 family—delivering a practical combination of logic capacity, embedded memory, and a high I/O count in a compact FBGA package. Its industrial temperature rating and surface-mount package make it suitable for rugged embedded and communications applications that need reliable, reconfigurable logic and on-chip storage.

Designers who require moderate DSP capability, flexible clocking, and high-speed I/O options can leverage the ECP3 family architecture and supporting configuration utilities and tools referenced in the family datasheet to accelerate development and deployment.

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