LFE3-35EA-6LFN484C

The LFE3-35EA-6LFN484C is an ECP3 Field Programmable Gate Array (FPGA) presented in a 484-BBGA package. It provides a high-density programmable logic fabric with substantial embedded memory and a large I/O count for designs that require flexible digital logic and on-chip storage.

Designed for commercial-grade applications, the device combines approximately 33,000 logic elements with about 1.36 Mbits of embedded RAM and 295 available I/Os, all in a surface-mount 484-FPBGA (23×23) package.

Key Features

• FPGA Core  ECP3 family device delivering a programmable logic fabric suitable for implementing custom digital functions.
• Logic Capacity  Approximately 33,000 logic elements to implement medium-to-high complexity logic designs.
• Embedded Memory  Approximately 1.36 Mbits (1,358,848 bits) of on-chip RAM for data buffering, FIFOs, and local storage.
• I/O Count  295 user I/Os providing a broad interface capability for peripherals, sensors, and external logic.
• Power Supply  Core voltage supply range from 1.14 V to 1.26 V.
• Package & Mounting  484-BBGA package (supplier device package: 484-FPBGA, 23×23) with surface-mount mounting type for compact board integration.
• Operating Range & Grade  Commercial grade device rated for operation from 0 °C to 85 °C.
• Regulatory  RoHS compliant.

Typical Applications

• Custom Digital Logic  Implement application-specific data paths and control logic using the device’s 33,000 logic elements and embedded RAM.
• I/O-Intensive Systems  Leverage 295 I/Os to connect multiple peripherals, sensors, or parallel interfaces on a single device.
• Embedded Memory Utilization  Use the approximately 1.36 Mbits of on-chip RAM for buffering, packet handling, and localized storage without external memory.
• Compact Board Designs  The 484-FPBGA (23×23) surface-mount package supports space-constrained PCBs where high integration is required.

Unique Advantages

• Balanced Logic and Memory:  The combination of ~33,000 logic elements and ~1.36 Mbits of embedded RAM supports mixed compute-and-buffering functions on-chip, reducing external component count.
• High I/O Density:  295 I/Os provide flexibility to interface with numerous external devices and parallel buses without immediate need for I/O expanders.
• Compact BGA Packaging:  484-BBGA (484-FPBGA, 23×23) enables high-density board layouts while maintaining surface-mount assembly compatibility.
• Commercial Temperature Rating:  Rated for 0 °C to 85 °C operation, matching typical commercial electronics deployment environments.
• RoHS Compliance:  Conforms to RoHS environmental requirements for lead-free manufacturing processes.
• Controlled Core Power Range:  Core supply specified between 1.14 V and 1.26 V for defined power sequencing and supply design.

Why Choose LFE3-35EA-6LFN484C?

The LFE3-35EA-6LFN484C positions itself as a practical choice for commercial embedded designs that require a balance of programmable logic capacity, embedded memory, and extensive I/O in a compact BGA package. Its approximately 33,000 logic elements and ~1.36 Mbits of on-chip RAM make it suitable for medium-to-complex digital functions while minimizing external component needs.

Engineers seeking a commercially rated FPGA with a high I/O count and surface-mount 484-FPBGA footprint will find this device a reliable option for scalable designs, prototyping, and production where RoHS compliance and well-defined power and temperature parameters are required.

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