LFE3-35EA-6LFN672I

The LFE3-35EA-6LFN672I is an ECP3 family Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation. It integrates a substantial pool of programmable logic, embedded memory, and a high count of I/O in a compact 672-ball BGA package for system-level integration.

With 33,000 logic elements, approximately 1.36 Mbits of on-chip RAM, and 310 I/O pins, this industrial-grade device targets designs that require mid-range logic capacity, dense I/O connectivity, and operation across a wide temperature range.

Key Features

• Logic Capacity 33,000 logic elements to implement combinational and sequential logic for complex programmable functions.
• Embedded Memory Approximately 1.36 Mbits of on-chip RAM for data buffering, state storage, and memory-mapped logic functions.
• I/O Density 310 general-purpose I/O pins provide broad external device interfacing and system connectivity.
• Power and Supply Operates from a core supply range of 1.14 V to 1.26 V, enabling defined power budgeting and integration with target system rails.
• Package and Mounting 672-ball BGA package; supplier device package listed as 672-FPBGA (27×27). Surface-mount design suitable for compact, board-level assembly.
• Industrial Temperature Grade Rated for operation from −40 °C to 100 °C, supporting deployment in temperature-challenging environments.
• Regulatory Compliance RoHS-compliant construction for lead-free manufacturing and regulatory alignment.

Typical Applications

• Industrial Control — Leverages the industrial temperature range and programmable logic capacity for motor control, automation logic, and factory instrumentation.
• Embedded Systems — Uses on-chip RAM and logic elements to implement custom processing blocks, protocol handling, and system glue logic in embedded products.
• High-Density I/O Subsystems — 310 I/O pins enable parallel sensor interfaces, bus bridging, or I/O expansion in compact designs.
• Prototyping and Development — Mid-range logic and memory resources provide a platform for validating system architectures and firmware/hardware partitioning.

Unique Advantages

• Substantial Logic Resources: 33,000 logic elements provide broad capacity for implementing complex custom logic without external ASICs.
• Integrated On-Chip Memory: Approximately 1.36 Mbits of embedded RAM reduces external memory dependency and simplifies board-level design.
• High I/O Count: 310 I/O pins support rich peripheral and sensor connectivity, enabling flexible system interfaces.
• Industrial Temperature Support: −40 °C to 100 °C rating permits use in demanding environmental conditions.
• Compact BGA Footprint: 672-ball (27×27) BGA enables a high-density implementation while conserving PCB area.
• RoHS Compliant: Meets lead-free manufacturing requirements for environmentally conscious designs.

Why Choose LFE3-35EA-6LFN672I?

The LFE3-35EA-6LFN672I positions itself as a mid-density, industrial-grade FPGA that balances programmable logic capacity, embedded memory, and extensive I/O in a compact BGA package. Its electrical and environmental specifications make it suitable for designs that require stable operation across a wide temperature range and integration of moderate on-chip memory and I/O resources.

This device is appropriate for engineers and procurement teams developing industrial control systems, embedded platforms, and I/O-rich subsystems who need a configurable logic solution with clearly specified supply, package, and temperature characteristics.

Request a quote or submit an inquiry to receive pricing, availability, and lead-time information for the LFE3-35EA-6LFN672I. Our team can provide the details you need to evaluate this FPGA for your design.