LFE3-35EA-7FN484I

The LFE3-35EA-7FN484I is an ECP3 Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation, offered in an industrial-grade specification. It provides 33,000 logic elements and approximately 1.36 Mbits of embedded memory in a 484‑ball BGA package, with up to 295 user I/O and a 1.14 V to 1.26 V core supply window.

Packaged for surface-mount assembly and rated for an operating temperature range of −40°C to 100°C, this device is specified for applications requiring high-density logic, embedded memory, and substantial I/O in a compact BGA footprint.

Key Features

• Core Logic 33,000 logic elements to implement custom digital logic, state machines, and control functions.
• Embedded Memory Approximately 1.36 Mbits of on-chip RAM for buffering, lookup tables, and memory-mapped logic.
• I/O Capacity Up to 295 user I/O pins, enabling extensive peripheral interfacing and board-level connectivity.
• Power Narrow core supply range of 1.14 V to 1.26 V for the FPGA core.
• Package & Mounting 484‑BBGA package (supplier designation 484‑FPBGA, 23×23) in a surface-mount format for high-density PCB integration.
• Industrial Temperature & Grade Industrial-grade device rated for operation from −40°C to 100°C.
• Regulatory Compliance RoHS compliant.

Typical Applications

• Industrial Control Industrial-temperature rating (−40°C to 100°C) and extensive I/O count support control logic, sensor interfacing, and automation tasks.
• High‑Density I/O Systems Up to 295 I/O pins enable implementations that require many external interfaces or parallel connections on a single device.
• Embedded Logic and Memory Combined logic capacity and approximately 1.36 Mbits of embedded RAM make the device suitable for designs requiring on‑chip buffering and localized data storage.

Unique Advantages

• Substantial Logic Capacity: 33,000 logic elements allow consolidation of multiple functions into a single FPGA, reducing component count.
• On‑Chip Memory: Approximately 1.36 Mbits of embedded RAM supports data buffering and localized storage without external memory.
• High I/O Density: 295 available I/O pins simplify board-level routing for complex systems and multiple peripheral connections.
• Industrial‑Level Reliability: Rated for −40°C to 100°C operation, suitable for deployments in demanding temperature environments.
• Compact BGA Footprint: 484‑BBGA (484‑FPBGA, 23×23) surface-mount package delivers high integration in a space-efficient form factor.
• RoHS Compliant: Meets RoHS requirements for environmental compliance.

Why Choose LFE3-35EA-7FN484I?

The LFE3-35EA-7FN484I combines a large logic fabric, substantial on‑chip memory, and a high I/O count in a compact 484‑ball BGA package, delivered in an industrial‑grade specification. It is positioned for designs that need integrated logic density, embedded memory resources, and robust operation across a wide temperature range.

This device is a practical choice for engineers and procurement teams seeking an FPGA that balances logic capacity, memory, and I/O in a surface-mount BGA form factor, while meeting RoHS and industrial-temperature requirements.

Request a quote or submit an inquiry to receive pricing and availability information for the LFE3-35EA-7FN484I.