LFE3-35EA-6FN484I

The LFE3-35EA-6FN484I is a Lattice ECP3 family FPGA providing a mid-range, industrial‑grade programmable logic solution. It combines a 1.2 V core architecture optimized for DSP and high‑speed serial interfaces with a compact 484‑BBGA (23 × 23 mm) surface‑mount package.

This device is targeted at high‑volume, high‑speed, and low‑cost embedded applications that require substantial I/O density, on‑chip RAM, and flexible interfacing while operating across an industrial temperature range.

Key Features

• Logic Capacity  Approximately 33,000 logic elements for implementing mid‑density FPGA designs.
• Embedded Memory  Approximately 1.36 Mbits of on‑chip RAM to support buffering, packet processing, and local data storage.
• I/O Density  Up to 295 user I/Os in the 484‑BBGA package to support broad interface requirements.
• High‑Speed Serial and Source‑Synchronous I/O  Family features include embedded SERDES and pre‑engineered source‑synchronous I/O support for high‑speed interfaces and memory connections.
• sysDSP Architecture  Enhanced DSP capabilities in the ECP3 family for multiply/accumulate and high‑performance arithmetic operations (family feature).
• Clocking and Timing  On‑chip PLLs and DLLs are supported across the ECP3 family for flexible clock management (family feature).
• Power and Voltage  Specified core voltage range: 1.14 V to 1.26 V.
• Package & Mounting  484‑BBGA (supplier package 484‑FPBGA, 23 × 23 mm); surface‑mount device.
• Industrial Temperature  Operating temperature range of −40 °C to 100 °C for industrial applications.
• Standards & Configuration Support  Family features include flexible configuration options such as SPI boot flash interface and dual‑boot images (family feature).
• RoHS Compliant  Device is RoHS compliant.

Typical Applications

• High‑speed networking  Implements protocol bridging, packet processing and interfacing where high I/O count and on‑chip RAM are required.
• Video and broadcast systems  Handles source‑synchronous interfaces and SERDES‑based links for video transport and processing applications.
• Embedded signal processing  Uses on‑chip memory and sysDSP capabilities for local filtering, aggregation, and real‑time compute tasks.
• Industrial communications and control  Provides a rugged operating temperature range and abundant I/O for industrial automation, sensor interfacing, and control systems.

Unique Advantages

• Balanced mid‑range capacity:  Around 33K logic elements and substantial embedded RAM deliver a balance of logic density and memory for many system designs.
• High I/O count in a compact package:  295 I/Os in a 23 × 23 mm 484‑BBGA footprint reduces board area while supporting complex interfacing requirements.
• Industrial robustness:  Rated for −40 °C to 100 °C operation, enabling deployment in industrial environments.
• Flexible configuration and boot options:  ECP3 family configuration features (SPI boot, dual‑boot support) simplify field updates and system integration.
• RoHS compliance:  Manufactured to meet RoHS requirements for environmental compliance.

Why Choose LFE3-35EA-6FN484I?

The LFE3-35EA-6FN484I delivers a practical combination of logic capacity, embedded memory, and high I/O density in a compact industrial‑grade package. It leverages the Lattice ECP3 family architecture to provide DSP‑oriented resources and high‑speed I/O features suitable for embedded systems, networking, video, and industrial applications.

Designers seeking a cost‑effective, scalable FPGA platform with flexible configuration options and a broad set of I/O and memory resources will find this device well suited to mid‑density system designs that require industrial temperature operation and surface‑mount packaging.

Request a quote or submit an inquiry for pricing and availability of the LFE3-35EA-6FN484I to begin integrating this FPGA into your next design.