LFE3-17EA-8MG328C

The LFE3-17EA-8MG328C is a commercial-grade FPGA in a 328-LFBGA CSBGA package from Lattice Semiconductor Corporation. It provides approximately 17,000 logic elements and embedded memory suitable for mid-range programmable logic designs. With 116 I/Os, a compact 328-CSBGA (10×10) package, and a low-voltage core supply range, this device targets space-constrained, power-conscious applications that require on-chip logic and memory integration.

Key Features

• Core Capacity – Approximately 17,000 logic elements to implement custom logic, state machines, and glue logic within a single device.
• Embedded Memory – Approximately 716,800 bits (~0.72 Mbits) of on-chip RAM for FIFOs, buffers, and small data stores.
• I/O Count – 116 general-purpose I/O pins to interface with peripherals, sensors, and external devices.
• Package and Mounting – 328-LFBGA, CSBGA package (supplier device package: 328-CSBGA, 10×10) in a surface-mount form factor for compact board designs.
• Power – Core voltage supply range of 1.14 V to 1.26 V to support low-voltage system architectures.
• Operating Conditions – Commercial temperature grade with an operating range of 0 °C to 85 °C.
• Environmental Compliance – RoHS compliant, meeting common lead-free manufacturing requirements.

Typical Applications

• Embedded System Glue Logic – Use the device’s ~17,000 logic elements and 116 I/Os to consolidate glue logic, protocol bridging, and custom control functions on a single chip.
• Interface and Peripheral Aggregation – Leverage the high I/O count and on-chip RAM to aggregate and buffer multiple peripheral interfaces or sensor streams.
• Prototyping and Low- to Mid-Scale FPGA Designs – Suitable for developers implementing custom logic, signal conditioning, or control algorithms in compact, surface-mount designs.

Unique Advantages

• Balanced Logic and Memory – Approximately 17,000 logic elements paired with ~0.72 Mbits of embedded RAM enable combined compute and data storage on-chip, reducing external memory needs.
• Compact, High-Density Package – The 328-CSBGA (10×10) package offers high pin count in a small footprint, helping minimize PCB area for space-constrained designs.
• Low-Voltage Core Operation – Core supply range of 1.14 V to 1.26 V supports integration into low-voltage system rails and power-optimized designs.
• RoHS Compliant – Meets lead-free assembly requirements for modern manufacturing processes.
• Commercial Temperature Range – Rated for 0 °C to 85 °C operation to suit a broad set of consumer and commercial applications.

Why Choose LFE3-17EA-8MG328C?

The LFE3-17EA-8MG328C delivers a mid-range FPGA option that balances logic capacity, embedded memory, and a substantial I/O count within a compact 328-LFBGA CSBGA package. Its low-voltage core and RoHS compliance make it appropriate for commercial designs where board space, power, and regulatory compliance are key considerations.

This device is well suited for engineers and teams building compact embedded systems, peripheral aggregation modules, or custom logic solutions that benefit from on-chip memory and a moderate number of logic resources. The package and electrical specifications provide a pragmatic platform for scalable designs and iterative development.

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