LFE3-17EA-8FTN256C

The LFE3-17EA-8FTN256C is an ECP3 Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation designed for commercial-grade embedded applications. It integrates 17,000 logic elements with approximately 0.72 Mbits of on-chip RAM and 133 user I/Os in a compact 256-ball FTBGA (17×17) surface-mount package. The device targets designers who need moderate logic density, flexible I/O, and a compact board footprint while operating within standard commercial temperature and supply ranges.

Key Features

• Core Logic  Provides 17,000 logic elements to implement moderate-density digital logic, state machines, and custom accelerators.
• Embedded Memory  Total on-chip RAM of 716,800 bits (approximately 0.72 Mbits) to support buffering, FIFOs, and small lookup tables.
• I/O  133 general-purpose I/O pins for flexible interfacing to peripherals, sensors, and external logic.
• Power  Core voltage supply range of 1.14 V to 1.26 V to match low-voltage FPGA power domains.
• Package & Mounting  Supplied in a 256-BGA / 256-FTBGA (17×17) surface-mount package that enables high-density PCB integration.
• Temperature & Grade  Commercial grade device rated for 0 °C to 85 °C operating temperature.
• Environmental Compliance  RoHS compliant for lead-free assembly and regulatory alignment in commercial products.

Typical Applications

• Commercial Embedded Systems  Implement control logic and custom processing in commercial devices that require moderate logic capacity and on-chip memory.
• I/O Expansion & Protocol Bridging  Use the 133 I/Os to bridge interfaces, perform signal adaptation, or aggregate peripheral connectivity on compact PCBs.
• Data Buffering and Small-Scale Processing  Leverage approximately 0.72 Mbits of embedded RAM for buffering, short data path storage, and simple data handling tasks.
• Space-Constrained Board Designs  The 256-FTBGA (17×17) surface-mount package supports dense layouts where board area is limited.

Unique Advantages

• Moderate Logic Density: 17,000 logic elements enable implementation of substantial application logic without moving to larger device classes.
• Ample I/O Count: 133 I/Os provide designers flexibility for multiple peripheral connections and interface options.
• On-Chip Memory Resources: Approximately 0.72 Mbits of embedded RAM supports buffering and small on-chip data structures, reducing external memory needs.
• Compact, Surface-Mount Package: The 256-FTBGA (17×17) package is suitable for high-density, space-optimized PCB designs.
• Commercial Temperature Range: Rated for 0 °C to 85 °C, the device aligns with standard commercial product operating environments.
• RoHS Compliant: Meets lead-free manufacturing requirements for commercial electronics production.

Why Choose LFE3-17EA-8FTN256C?

The LFE3-17EA-8FTN256C balances logic capacity, embedded memory, and a generous I/O count in a compact 256-ball FTBGA package, making it a practical choice for commercial embedded designs that require integration without excessive board area. Its voltage and temperature specifications align with common commercial system designs, and RoHS compliance supports contemporary manufacturing processes.

This device is well suited for engineers and product teams developing commercial embedded systems, interface bridges, and space-constrained applications where moderate FPGA resources and reliable packaging are key considerations.

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