LFE3-17EA-7MG328C

The LFE3-17EA-7MG328C is a Lattice ECP3 family FPGA providing 17,000 logic elements in a compact 328-CSBGA (10 × 10 mm) surface-mount package. Designed for mid-range system integration, this device combines programmable logic, on-chip RAM and DSP resources with high-speed SERDES channels and flexible I/O to address communications, embedded signal processing and memory-interface applications.

Key Features

• Core Capacity  17,000 logic elements for mid-range integration and complex digital logic.
• Embedded Memory  Total on-chip RAM 716,800 bits (approximately 0.72 Mbits) with distributed RAM resources for buffering and state storage.
• DSP and Multipliers  sysDSP architecture with dedicated multiply/accumulate resources and 24 × 18×18 multipliers to accelerate arithmetic and signal-processing tasks.
• Embedded SERDES  SERDES capability with device-level support for data rates up to 3.2 Gbps and, for the 328-CSBGA package, 2 SERDES channels alongside 116 user I/Os.
• Programmable sysI/O  116 I/Os with wide interface support including LVTTL, LVCMOS (3.3/2.5/1.8/1.5/1.2 V), SSTL, HSTL and differential standards such as LVDS and LVPECL for mixed-signal system interfacing.
• Clocking Resources  Integrated clock management with 2 PLLs and 2 DLLs to support multiple clock domains and timing control.
• Flexible Configuration & Reliability  Support for SPI boot flash, dual-boot images, TransFR I/O for field updates and on-chip soft error detection for configuration robustness.
• Package, Power & Temperature  328-CSBGA (10 × 10 mm) surface-mount package; core voltage supply 1.14 V to 1.26 V; commercial operating range 0 °C to 85 °C; RoHS compliant.
• System-Level Support  IEEE 1149.1 and IEEE 1532 support, Reveal logic analyzer compatibility, ORCAstra configuration tools and an on-chip oscillator for initialization and system use.

Typical Applications

• High-Speed Communications  Use the embedded SERDES and programmable I/O to implement interfaces such as PCI Express, Ethernet, SONET/SDH and other serial links requiring multi-gigabit channels.
• Embedded Signal Processing  Leverage sysDSP and the array of 18×18 multipliers for MAC-intensive tasks, filters and digital front-end processing.
• Memory and Interface Bridging  Combine on-chip RAM and dedicated DDR interface support to implement memory controllers, buffering and data-path logic between peripherals and processors.
• Video & Broadcast Transport  Implement transport and timing functions for standards such as SMPTE 3G and other high-bandwidth media links using SERDES and DSP resources.

Unique Advantages

• Highly integrated mid-range FPGA: 17,000 logic elements and on-chip memory reduce external component count and simplify board-level design.
• Built for high-speed serial connectivity: Device-level SERDES capability (up to 3.2 Gbps) and package-specific SERDES channels support modern link protocols.
• Purpose-built DSP resources: sysDSP slices and dedicated multipliers speed implementation of arithmetic-heavy functions without extensive logic fabric use.
• Flexible I/O and clocking: Wide range of supported I/O standards and integrated PLL/DLL resources enable diverse interface options and multi-clock designs.
• Compact footprint: 328-CSBGA (10 × 10 mm) package delivers a dense solution for space-constrained applications.
• Commercial-grade and RoHS compliant: Operates across 0 °C to 85 °C with RoHS compliance for standard commercial deployments.

Why Choose LFE3-17EA-7MG328C?

The LFE3-17EA-7MG328C positions itself as a compact, mid-range FPGA option combining 17,000 logic elements, approximately 0.72 Mbits of on-chip RAM, dedicated DSP multipliers and multi-gigabit SERDES capability in a 328-CSBGA package. It is suited to designers who need a balance of logic capacity, embedded memory and high-speed serial interfaces without moving to larger device classes.

This device is appropriate for communications, embedded processing and interface bridging applications where integration, flexible I/O standards and compact packaging deliver clear system-level benefits. The device’s configuration and system-level tools support deployment and field updates, providing long-term design scalability within the ECP3 family.

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