LFE3-17EA-7LFTN256C

The LFE3-17EA-7LFTN256C is a Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation, provided in a 256-ball fine-pitch BGA package. It delivers a balance of programmable logic capacity and on-chip memory with 17,000 logic elements and approximately 0.72 Mbits of embedded RAM, alongside 133 general-purpose I/Os.

Designed as a commercial-grade, surface-mount device, this FPGA operates from a 1.14 V to 1.26 V supply and supports an operating temperature range of 0 °C to 85 °C, making it suitable for a wide range of standard embedded digital designs.

Key Features

• Core Logic 17,000 logic elements provide the resources for implementing custom digital functions, finite-state machines, and glue logic.
• Embedded Memory Approximately 0.72 Mbits of on-chip RAM for buffering, lookup tables, and small data storage requirements.
• I/O Capacity 133 user I/Os available for interfacing with peripherals, sensors, and external logic.
• Power Supports a supply voltage range of 1.14 V to 1.26 V to match system power rails and regulator options.
• Package 256-ball FTBGA (17 × 17) surface-mount package for compact board integration and high-density routing.
• Operating Range Commercial-grade temperature rating from 0 °C to 85 °C suitable for standard consumer and industrial-adjacent applications.
• Compliance RoHS-compliant construction for regulatory and environmental compatibility.

Typical Applications

• Interface and I/O Bridging — Use the 133 I/Os to implement protocol translators, bus interfaces, and peripheral aggregation on a compact BGA footprint.
• Embedded Logic Acceleration — Leverage 17,000 logic elements and on-chip RAM to offload deterministic, timing-critical functions from processors.
• Data Buffering and Packet Handling — Approximately 0.72 Mbits of embedded RAM can be applied to buffering, small FIFOs, and lookup operations in communication or streaming designs.

Unique Advantages

• Balanced Logic and Memory: Combines 17,000 logic elements with approximately 0.72 Mbits of embedded RAM to support moderate-complexity designs without external memory for many use cases.
• Generous I/O Count: 133 I/Os enable flexible connectivity to sensors, transceivers, and user interfaces, reducing the need for additional interfacing chips.
• Compact, High-Density Package: The 256-FTBGA (17×17) package allows high pin-count I/O in a space-efficient form factor for dense PCB layouts.
• Commercial-Grade Reliability: Designed for 0 °C to 85 °C operation and RoHS-compliant manufacturing to meet common production and environmental requirements.
• Controlled Power Envelope: Narrow supply range (1.14 V–1.26 V) simplifies power supply design for systems targeting this device.

Why Choose LFE3-17EA-7LFTN256C?

The LFE3-17EA-7LFTN256C is positioned as a commercially graded FPGA option that delivers a practical combination of logic capacity, embedded memory, and I/O count in a compact 256-BGA package. It is well-suited for designers who need programmable logic resources for interface bridging, embedded acceleration, and medium-complexity digital functions while maintaining a compact board footprint.

Backed by Lattice Semiconductor Corporation’s FPGA platform, this device offers predictable electrical and thermal characteristics—1.14 V to 1.26 V supply and 0 °C to 85 °C operating range—providing a clear specification set for procurement and system integration.

Request a quote or submit a purchase inquiry to receive pricing and availability information for the LFE3-17EA-7LFTN256C. Technical and sales teams can provide lead-time details and procurement options.