LFE3-17EA-7LMG328I

The LFE3-17EA-7LMG328I is an ECP3 family Field Programmable Gate Array (FPGA) IC offering 17,000 logic elements and 116 user I/Os in a compact 328-CSBGA (10 × 10 mm) package. As part of the LatticeECP3 family, this device integrates enhanced DSP resources, embedded RAM, programmable I/O and embedded SERDES to serve high-volume, high-speed, low-cost applications.

This industrial-grade, surface-mount FPGA supports a core supply range of 1.14 V to 1.26 V and an operating temperature range of -40 °C to 100 °C, making it suitable for a broad set of industrial and communications designs.

Key Features

• Core Capacity  17,000 logic elements providing mid-range logic density for system integration and control logic.
• Embedded Memory  Approximately 0.72 Mbits (716,800 bits) of on-chip RAM for data buffering, state storage and local memory needs.
• DSP and Arithmetic  Family-level sysDSP architecture for high-performance multiply/accumulate operations and advanced ALU support.
• High-Speed SERDES  Embedded SERDES channels (device/package combination supports 2 SERDES channels for 328-CSBGA) with family-level data rates up to 3.2 Gbps for serial protocols.
• Programmable sysI/O  Flexible I/O buffer support across many standards including LVTTL, LVCMOS (3.3/2.5/1.8/1.5/1.2 V), SSTL, HSTL, LVDS and other differential standards, plus on-chip termination and optional input equalization.
• Clocking and Timing  Family features include up to ten PLLs and two DLLs for clock management and source-synchronous interfaces.
• Configuration and Reliability  Flexible configuration options including SPI boot flash interface, dual-boot images and Soft Error Detect embedded macro (family-level support).
• Package and Thermal  328-LFBGA (CSBGA, 10 × 10 mm) surface-mount package; industrial operating range -40 °C to 100 °C.
• Power  Core supply nominal range 1.14 V to 1.26 V for low-voltage system designs.
• RoHS Compliant  Device is compliant with RoHS environmental requirements.

Typical Applications

• High-speed serial connectivity  Use the embedded SERDES channels and flexible I/O to implement protocol bridges, serial links and network interfaces.
• Signal processing and embedded DSP  Leverage sysDSP resources and on-chip RAM for filtering, MAC operations and real-time data processing.
• Industrial control and automation  Industrial temperature rating and broad I/O standard support make this device suitable for motor control, sensor aggregation and deterministic control logic.
• Memory and interface bridging  Dedicated source-synchronous I/O and memory timing resources enable DDR/DDR2/DDR3 interfacing and high-speed ADC/DAC front-end support (family-level features).

Unique Advantages

• Compact, mid-range integration: 17,000 logic elements plus embedded RAM and DSP capabilities reduce external components and lower BOM count for mid-size designs.
• Flexible serial and parallel I/O: 116 user I/Os and programmable sysI/O support a wide range of single-ended and differential standards, simplifying mixed-signal and mixed-voltage designs.
• Industrial operating range: Rated for -40 °C to 100 °C operation to meet demanding environmental requirements.
• Low-voltage core: 1.14 V to 1.26 V core supply supports modern low-power system architectures.
• System-level support (family-level): Includes configuration utilities and embedded features such as SPI boot, dual-boot capability and on-chip soft error detection to streamline deployment and field updates.
• Small package footprint: 328-CSBGA (10 × 10 mm) package enables space-constrained board designs while still providing significant I/O and serial capability.

Why Choose LFE3-17EA-7LMG328I?

As a member of the LatticeECP3 family, the LFE3-17EA-7LMG328I balances logic capacity, embedded memory and DSP features with flexible I/O and serial connectivity in a compact, industrial-rated package. It is well suited for designers seeking a mid-range FPGA that integrates signal processing, protocol interfacing and memory buffering without requiring a larger device footprint.

This part is aimed at customers building high-volume, high-speed, cost-sensitive systems that require reliable operation across wide temperature ranges and support for diverse interface standards. The combination of 17,000 logic elements, approximately 0.72 Mbits of embedded RAM, 116 I/Os and family-level SERDES and clocking features delivers a practical, scalable platform for industrial, communications and embedded applications.

Request a quote or submit an RFQ to get pricing and availability for the LFE3-17EA-7LMG328I. Our team can provide delivery lead times and support for your design-in needs.