LFE3-17EA-7LFN484I

The LFE3-17EA-7LFN484I is a Lattice Semiconductor ECP3 family FPGA offering 17,000 logic elements, 222 user I/Os and approximately 716,800 bits of on-chip RAM. It implements the ECP3 architecture optimized for embedded logic, DSP functions and high-speed serial and parallel I/O.

Designed for industrial applications, this surface-mount 484-BBGA package combines mid-range logic density and flexible I/O with on-chip memory and DSP resources—making it suitable for communication interfaces, embedded processing and high-speed I/O integration.

Key Features

• Core Logic – 17,000 logic elements and 2,125 CLB-style logic blocks provide mid-range programmable logic capacity for control, protocol handling and filtering tasks.
• Embedded Memory – Approximately 716,800 bits (~0.72 Mbits) of on-chip RAM for buffers, FIFOs and small embedded datasets.
• High-density I/O – 222 user I/Os routed through the 484-BBGA package support a wide range of parallel and source-synchronous interfaces.
• High-speed serial support (series capability) – ECP3 family SERDES capabilities and supported data rates (as documented for the family) enable implementation of high-speed serial protocols and multi-gigabit links when used in appropriate package/I/O configurations.
• sysDSP and DSP slices (family) – Family-level sysDSP architecture delivers specialized multiply-accumulate resources for signal processing and algorithm acceleration.
• Flexible voltage and temperature range – Core voltage range 1.14 V to 1.26 V and industrial operating temperature from −40 °C to 100 °C for robust deployment environments.
• Package & mounting – Surface-mount 484-BBGA (supplier package: 484-FPBGA, 23 × 23 mm) for compact board-level integration.
• Compliance – RoHS compliant.

Typical Applications

• High-speed communications – Implement protocol handling and SERDES-based links such as multi-gigabit interfaces documented for the ECP3 family.
• Embedded signal processing – Use on-chip sysDSP resources and embedded RAM for filtering, signal conditioning and acceleration of math-intensive tasks.
• Memory interface and buffering – On-chip RAM and source-synchronous I/O support DDR-style memory interfaces and data buffering.
• Industrial control and automation – Industrial-grade temperature range and numerous I/Os make the device suitable for sensor aggregation, protocol bridging and control logic.

Unique Advantages

• Balanced logic density and I/O – 17K logic elements paired with 222 I/Os support complex control and interfacing without large-package complexity.
• On-chip RAM for system integration – Approximately 0.72 Mbits of embedded memory reduces external memory requirements for many buffering and state-storage needs.
• Industrial temperature capability – Rated for −40 °C to 100 °C operation to meet demanding environmental conditions.
• Compact BGA footprint – 484-BBGA (23 × 23 mm supplier package) enables high-density board designs while keeping routing manageable.
• Family-level high-speed features – ECP3 family SERDES, sysDSP and flexible I/O standards provide a clear upgrade path within the family for designs that may require greater density or additional high-speed channels.

Why Choose LFE3-17EA-7LFN484I?

The LFE3-17EA-7LFN484I positions itself as a mid-range FPGA that balances programmable logic capacity, embedded memory and a large complement of I/Os in a compact surface-mount BGA package. Its industrial temperature rating and defined core voltage range make it suitable for deployed systems that require reliable, long-life operation.

For engineers designing communication subsystems, embedded signal processing blocks or compact control units, this device delivers the ECP3 family feature set—logic, RAM and I/O density—backed by Lattice’s development ecosystem and family-level tools.

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