LFE3-17EA-7FTN256C

The LFE3-17EA-7FTN256C is a commercial-grade ECP3 family Field Programmable Gate Array (FPGA) IC designed for configurable digital logic and interface implementations. It offers 17,000 logic elements with approximately 0.72 Mbits of embedded memory and 133 general-purpose I/Os in a compact 256‑BGA surface-mount package.

With a core supply range of 1.14 V to 1.26 V and an operating temperature range of 0 °C to 85 °C, this device is suited for a variety of commercial applications that require flexible, reprogrammable logic and moderate on-chip memory and I/O capacity. The device is RoHS compliant.

Key Features

• Core Logic 17,000 logic elements provide reconfigurable digital resources for implementing custom logic, finite-state machines, and glue logic.
• Embedded Memory Approximately 0.72 Mbits of on-chip RAM for data buffering, small FIFOs, and local storage.
• I/O Capability 133 I/O pins available for interfacing with peripherals, buses, and external devices.
• Power Core voltage supply range of 1.14 V to 1.26 V to match low-voltage system designs.
• Package & Mounting 256‑BGA (256‑FTBGA, 17×17) surface-mount package provides a compact footprint for space-constrained PCBs.
• Operating Conditions Commercial temperature grade with an operating range of 0 °C to 85 °C.
• Environmental Compliance RoHS compliant for lead-free assembly and regulatory alignment.

Typical Applications

• Configurable Digital Logic Implement custom datapath logic, protocol translators, and state machines where reprogrammability is required.
• Interface Bridging Handle bus bridging, level translation, and signal multiplexing using available I/O and programmable resources.
• Embedded System Glue Integrate peripheral control, custom timing, and control logic to consolidate discrete components.
• Prototyping and Development Use the device for early hardware validation and iterative firmware/hardware co-design in commercial projects.

Unique Advantages

• Substantial Logic Capacity: 17,000 logic elements enable mid-density designs without immediate escalation to larger device families.
• Balanced On-Chip Memory: Approximately 0.72 Mbits of embedded RAM supports local buffering and small data structures, reducing external memory needs.
• Ample I/O Count: 133 I/Os support multiple peripherals and buses, simplifying board-level routing and connectivity.
• Compact, Surface-Mount Package: The 256‑BGA package offers a high pin count in a small footprint for space-constrained commercial products.
• Commercial Temperature and RoHS Compliance: Designed for standard commercial environments and compliant with RoHS requirements for lead-free assembly.
• Low-Voltage Core Compatibility: The 1.14 V to 1.26 V supply range aligns with modern low-voltage system power rails.

Why Choose LFE3-17EA-7FTN256C?

The LFE3-17EA-7FTN256C positions itself as a mid-density, commercial FPGA option that balances logic capacity, embedded memory, and I/O flexibility in a compact 256‑BGA package. It is well suited to teams and designs that need reprogrammable logic for interface tasks, custom control logic, and prototyping within commercial temperature ranges.

Choose this device when you require a reconfigurable solution that provides meaningful on-chip memory and a substantial I/O complement while adhering to RoHS standards and compact board-level integration.

Request a quote or submit an inquiry to receive pricing and availability for the LFE3-17EA-7FTN256C and to discuss how it fits your design requirements.