LFE3-17EA-6MG328C

The LFE3-17EA-6MG328C is a Lattice ECP3 family FPGA offering 17,000 logic elements in a compact 328‑CSBGA (10 × 10 mm) package. Designed for high‑volume, high‑speed, cost‑sensitive designs, this device combines programmable logic, embedded DSP resources and flexible I/O for communications, video and general embedded applications.

Key engineering attributes include approximately 0.72 Mbits of on‑chip embedded memory, 116 user I/Os, low core voltage operation (1.14 V–1.26 V), and commercial temperature grading (0 °C to 85 °C).

Key Features

• Core Logic  17,000 logic elements providing the programmable fabric for control, protocol processing and glue logic.
• Embedded Memory  Approximately 0.72 Mbits of on‑chip embedded memory to support buffering, FIFOs and local storage.
• DSP and Multiply Resources  Dedicated DSP resources including 18×18 multipliers (24 for this device) for multiply‑accumulate and signal processing tasks.
• Embedded SERDES  Family SERDES capability supports data rates from 150 Mbps to 3.2 Gbps; this 328‑CSBGA package provides up to 2 SERDES channels per the datasheet package mapping.
• Programmable sysI/O Buffer  Flexible I/O standards supported (LVTTL, LVCMOS, SSTL, HSTL, LVDS and others) for wide compatibility with external devices and memory interfaces.
• Clocking and Timing  On‑chip timing resources including PLLs and DLLs (2 PLLs / 2 DLLs for this device class) to support system clock generation and deskewing.
• Package & Mounting  328‑LFBGA / CSBGA (10 × 10 mm) surface‑mount package suitable for compact board designs requiring up to 116 I/Os.
• Power & Temperature  Core supply specified from 1.14 V to 1.26 V; commercial operating temperature range 0 °C to 85 °C.

Typical Applications

• Communications & Networking  High‑speed serial links and protocol bridging leveraging on‑chip SERDES and programmable I/O standards for Ethernet, PCIe‑style or other serial interfaces.
• Video & Broadcast Interfaces  Signal interfacing and timing functions for SMPTE/serial video applications using the device’s SERDES and timing resources.
• DSP and Signal Processing  Real‑time filtering, MAC operations and data path acceleration using the dedicated multipliers and sysDSP resources.
• Embedded Control & Glue Logic  Compact, low‑voltage FPGA solution for control logic, protocol conversion, and peripheral aggregation in space‑constrained designs.

Unique Advantages

• Highly integrated FPGA fabric: Combines 17K logic elements, embedded memory and DSP multipliers to reduce external component count and simplify designs.
• Flexible I/O and SERDES support: Programmable sysI/O and high‑speed SERDES channels enable broad interface compatibility and high‑throughput links.
• Compact package footprint: 328‑CSBGA (10 × 10 mm) delivers a high level of integration in a small board area for space‑constrained applications.
• Low core voltage operation: 1.14 V–1.26 V core supply supports modern power architectures and helps reduce system power consumption.
• Engineered for high‑volume designs: ECP3 family architecture targets a balance of performance and cost suitable for production deployments.

Why Choose LFE3-17EA-6MG328C?

The LFE3-17EA-6MG328C positions itself as a compact, cost‑aware FPGA choice when you need a combination of mid‑density logic, modest embedded memory and DSP capability plus flexible, high‑speed I/O. Its 328‑CSBGA package and commercial temperature grading make it well suited to consumer, communications and embedded applications where board size and integration matter.

For designs that require scalable FPGA resources within the ECP3 family, this device delivers a balanced mix of logic, memory, SERDES and clocking resources backed by the family’s configuration and development toolchain.

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