LFE3-17EA-6LFTN256I

The LFE3-17EA-6LFTN256I is a LatticeECP3 family FPGA providing 17,000 logic elements in a 256-FTBGA (17 × 17 mm) surface-mount package. It combines a mid-range logic fabric with on-chip memory and DSP resources targeted at high-performance, cost-sensitive embedded and communications designs.

With 133 user I/Os, embedded SERDES capability for multi-gigabit serial links in the family, and flexible configuration options, this industrial-grade device (–40 °C to 100 °C) is suited for networking, video, data-acquisition, and general-purpose interface and protocol bridging applications. The device operates from a 1.14 V to 1.26 V core supply and is RoHS compliant.

Key Features

• Logic Capacity  17,000 logic elements provide a programmable fabric for implementing control, glue logic, protocol handling, and moderate-scale datapath functions.
• Embedded DSP and Multipliers  Family sysDSP architecture supports high-performance multiply and accumulate operations; the ECP3-17 configuration includes 24 18×18 multipliers for DSP workloads.
• On-Chip Memory  Total on-chip RAM of 716,800 bits (approximately 0.72 Mbits) for embedded block RAM and distributed memory storage.
• High-Density I/O and SERDES  133 user I/Os with the family’s pre-engineered source-synchronous I/O and a 256-FTBGA package that the datasheet lists with 4 SERDES channels for high-speed serial interfaces.
• Clocking and Timing  Device family supports multiple PLLs and DLLs (ECP3-17 listing shows 2 PLLs and 2 DLLs) to support clock management and high-speed interfaces.
• Flexible Configuration  Supports SPI boot flash interface, dual-boot images, slave SPI, and TransFR I/O for in-field updates, plus on-chip oscillator for initialization.
• Package and Mounting  256-FTBGA (17 × 17 mm) surface-mount package for compact board integration; supplier device package listed as 256-FTBGA.
• Industrial Temperature and RoHS  Rated for –40 °C to 100 °C operation and RoHS compliant for industrial deployments.

Typical Applications

• Networking & Communications  Implement packet processing, protocol bridging, and serial links leveraging the ECP3 family’s SERDES and abundant I/O.
• Video & Broadcast Systems  Support SMPTE and other high-speed video interfaces using the device’s source-synchronous I/O and DSP resources.
• Data Acquisition & ADC/DAC Front-Ends  Integrate ADC/DAC interfaces and pre/post-processing pipelines using on-chip RAM and DSP multipliers.
• Industrial Control & Instrumentation  Provide deterministic control functions and custom I/O handling across the industrial temperature range.

Unique Advantages

• Balanced Performance and Cost  17,000 logic elements with integrated DSP and memory deliver a capable platform for mid-range FPGA tasks without unnecessary overhead.
• Integrated DSP Resources  Twenty-four 18×18 multipliers enable efficient implementation of signal processing and filtering algorithms on-chip.
• Flexible High-Speed I/O  133 I/Os combined with family SERDES and source-synchronous support simplify integration of multi-gigabit and parallel interfaces.
• Compact, Rugged Package  256-FTBGA (17 × 17 mm) surface-mount package reduces board area while supporting industrial temperature operation.
• Field Update and Boot Flexibility  SPI boot, dual-boot images, and TransFR I/O support allow flexible configuration and in-field firmware updates.
• System-Level Clocking  Multiple PLLs/DLLs provide the clocking resources needed for mixed-frequency, multi-interface systems.

Why Choose LFE3-17EA-6LFTN256I?

The LFE3-17EA-6LFTN256I delivers a practical balance of programmable logic, embedded memory, DSP multipliers, and flexible I/O in a compact industrial-grade package. It is positioned for designers who need moderate logic density, on-chip RAM, and high-speed interface capability in applications such as communications, video, industrial control, and data-acquisition systems.

Backed by the LatticeECP3 family architecture and configuration features, this device offers scalable performance and in-field configurability for production designs that require reliable operation across a wide temperature range.

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