LFE3-17EA-6LFN484I

The LFE3-17EA-6LFN484I is an ECP3 family FPGA from Lattice Semiconductor Corporation designed for industrial-grade embedded applications. It provides a balance of programmable logic, on-chip memory and high I/O density in a compact BGA package suitable for surface-mount board designs.

With 17,000 logic elements, approximately 0.717 Mbits of embedded memory and 222 I/O pins, this device targets designs that require significant logic resources, substantial embedded RAM, and a large number of external interfaces while operating across an industrial temperature range.

Key Features

• Logic Capacity — 17,000 logic elements to implement medium-density programmable logic and custom hardware functions.
• Embedded Memory — Approximately 0.717 Mbits of on-chip RAM for buffering, FIFOs and small data stores within the FPGA fabric.
• I/O Density — 222 general-purpose I/O pins to support multiple parallel interfaces and high pin-count connectivity.
• Power — Core voltage supply range of 1.14 V to 1.26 V for compatibility with low-voltage system designs.
• Package and Mounting — 484-BBGA package (supplier device package: 484-FPBGA, 23 × 23) in a surface-mount form factor for compact board integration.
• Industrial Temperature Range — Rated for operation from −40 °C to 100 °C, suitable for industrial environments.
• Regulatory — RoHS compliant for environmental and manufacturing compliance.

Typical Applications

• Industrial Control — Implement motion control, protocol bridging and custom logic in industrial systems that require robust temperature performance.
• High-Density I/O Interfaces — Serve as an interface hub for systems needing many parallel or serial connections, leveraging 222 I/O pins.
• Embedded System Acceleration — Offload compute-intensive or timing-critical functions using the FPGA’s logic and on-chip memory resources.
• OEM Board Designs — Compact 484-BBGA surface-mount package fits space-constrained assemblies for original equipment manufacturers.

Unique Advantages

• Substantial Logic Resources: 17,000 logic elements provide headroom for complex custom logic implementations without external ASICs.
• On-Chip Memory: Approximately 0.717 Mbits of embedded RAM reduces dependence on external memory for buffering and temporary storage.
• Wide Temperature Range: −40 °C to 100 °C rating supports deployment in industrial environments where extended temperature tolerance is required.
• High I/O Count: 222 I/O pins enable multiple interface connections and flexible board-level partitioning of signals.
• Compact, Surface-Mount BGA: 484-BBGA (484-FPBGA, 23 × 23) package minimizes PCB footprint while supporting dense pinout requirements.
• RoHS Compliant: Conforms to RoHS requirements for environmentally conscious manufacturing and supply chain compliance.

Why Choose LFE3-17EA-6LFN484I?

The LFE3-17EA-6LFN484I positions itself as a reliable industrial-grade FPGA option that combines a sizable logic fabric, meaningful on-chip memory and a high I/O count in a compact BGA package. It is well suited to embedded and industrial applications that need programmable logic capacity with robust temperature and manufacturing compliance.

Designed and supplied by Lattice Semiconductor Corporation, this device is appropriate for engineers and OEMs building medium-density FPGA solutions where integration, thermal tolerance and board-level density are key decision factors.

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