LFE3-17EA-6FTN256I

The LFE3-17EA-6FTN256I is a Lattice Semiconductor ECP3 family FPGA offering 17,000 logic elements in a compact 256-FTBGA (17 × 17 mm) package. This industrial-grade, surface-mount device provides 133 user I/Os and approximately 0.72 Mbits of on-chip RAM, making it suitable for embedded designs that require a balance of logic density, on-chip memory, and flexible I/O.

Built on the Lattice ECP3 architecture, the device includes on-chip clocking resources and advanced DSP and SERDES capabilities described for the family, enabling applications that need high-performance serial links, signal processing, and source-synchronous interfaces while operating across an industrial temperature range.

Key Features

• Logic Capacity  17,000 logic elements for implementing mid-density FPGA designs.
• Embedded Memory  Total on-chip RAM of 716,800 bits (approximately 0.72 Mbits) for frame buffers, FIFOs, and storage of configuration data.
• I/O and SERDES  133 user I/Os in the 256-FTBGA package; the ECP3 family supports embedded SERDES channels in this package configuration as specified in the family data.
• DSP Resources  Family-level sysDSP features (cascadable DSP slices and multiply-accumulate capabilities) are available in the ECP3 architecture to support signal-processing tasks.
• Clocking  Device-level PLLs and DLLs are supported across the ECP3 family; refer to family data for routing and clock management options.
• Flexible Device Configuration  Family features include SPI boot flash interface, dual-boot image support, and field-update capability via TransFR I/O (as described for ECP3 devices).
• Package & Mounting  256-FTBGA (17 × 17 mm) surface-mount package for board-level density and reliable soldered connections.
• Power and Temperature  Core supply range 1.14 V to 1.26 V; industrial operating temperature range −40 °C to 100 °C.
• Environmental Compliance  RoHS compliant.

Typical Applications

• High-speed communications  SERDES-capable ECP3 family features and 133 I/Os support protocol bridging and interface logic for Ethernet, PCIe, and other serial links described in the family data.
• Signal processing & instrumentation  sysDSP slice architecture and on-chip memory make the device suitable for DSP tasks such as filtering, accumulation, and data aggregation.
• Memory interface and source-synchronous designs  On-chip resources and ECP3 family source-synchronous I/O support are useful for managing DDR memory interfaces and high-speed ADC/DAC connections.
• Industrial embedded systems  Industrial-grade temperature rating and surface-mount 256-FTBGA package fit rugged embedded control and networking applications.

Unique Advantages

• Balanced mid-range capacity: 17,000 logic elements with substantial on-chip RAM provides a compact platform for moderate-complexity designs without excessive board-level components.
• Rich I/O in a compact package: 133 I/Os in a 17 × 17 mm 256-FTBGA give high connectivity density for multi-interface designs.
• Industrial temperature support: Rated for −40 °C to 100 °C to meet the needs of industrial and embedded deployments.
• Flexible configuration and field updates: Family-level support for SPI boot flash, dual-boot images, and TransFR I/O enables secure and serviceable firmware management.
• Regulatory compliance: RoHS compliance simplifies environmental and manufacturing acceptance.

Why Choose LFE3-17EA-6FTN256I?

The LFE3-17EA-6FTN256I positions itself as a practical, industrial-grade FPGA option for designers who need a mid-density programmable fabric with substantial I/O and embedded memory. Its combination of 17,000 logic elements, approximately 0.72 Mbits of on-chip RAM, and the I/O/packaging density of the 256-FTBGA makes it well suited for communications, DSP, and embedded control applications that must operate across a wide temperature range.

Backed by the Lattice ECP3 family architecture and configuration features, the device offers a scalable platform for products that require field-update capability, flexible boot options, and reliable on-board integration while maintaining a compact footprint.

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