LFE3-17EA-6FN484C

The LFE3-17EA-6FN484C is an ECP3 Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation. It delivers a mid-range logic capacity with 17,000 logic elements, approximately 0.72 Mbits of embedded memory, and 222 user I/O in a compact 484-BBGA package.

Designed for commercial-grade electronic systems, this device combines moderate on-chip memory, significant I/O resources, and low-voltage operation to support custom logic integration and system interfacing in space-constrained board designs.

Key Features

• Core Architecture ECP3 family FPGA implementation providing a balance of logic capacity and I/O resources for mid-density designs.
• Logic Capacity 17,000 logic elements for implementing custom digital functions and soft IP.
• Embedded Memory Approximately 0.72 Mbits of on-chip RAM (716,800 bits) to support buffering, FIFOs, and small data structures.
• I/O 222 user I/O pins to accommodate multiple interfaces, peripherals, and system connections.
• Power Low-voltage supply range from 1.14 V to 1.26 V for core power, enabling integration with low-voltage system rails.
• Package & Mounting 484-BBGA package (supplier device package: 484-FPBGA, 23 × 23 mm) with surface-mount assembly suitable for compact PCB layouts.
• Operating Range & Grade Commercial grade device rated for 0 °C to 85 °C operation.
• Environmental Compliance RoHS compliant.

Typical Applications

• Logic Prototyping and IP Integration Use the 17,000 logic elements and on-chip memory to prototype custom logic, validate IP cores, and consolidate glue logic on a single device.
• System I/O Aggregation 222 I/O pins provide the connectivity needed for aggregating multiple interfaces and peripherals in communications or control boards.
• Compact Board Designs The 484-BBGA (23 × 23 mm) package supports high-density PCB layouts where board space is constrained.

Unique Advantages

• Significant Logic Density: 17,000 logic elements enable integration of complex glue logic and moderate-size custom functions without external ASICs.
• Ample I/O Count: 222 user I/O pins simplify interface routing and reduce the need for additional I/O expanders.
• On-Chip Embedded Memory: Approximately 0.72 Mbits of RAM provides local storage for buffering, state machines, and small data structures.
• Low-Voltage Core: 1.14 V to 1.26 V supply compatibility helps minimize power rail complexity in modern low-voltage systems.
• Compact BGA Package: 484-FPBGA (23 × 23 mm) supports high-density mounting while maintaining thermal and electrical performance for commercial applications.
• RoHS Compliant: Meets regulatory expectations for environmental compliance in global supply chains.

Why Choose LFE3-17EA-6FN484C?

The LFE3-17EA-6FN484C positions itself as a practical mid-density FPGA choice for commercial embedded designs that require a balance of logic capacity, embedded memory, and extensive I/O in a compact board footprint. Its low-voltage core and RoHS compliance make it suitable for modern low-power systems and environmentally conscious manufacturing.

This device is well suited for designers who need to consolidate digital functions, manage multiple interfaces, and maintain a compact PCB layout while operating within a commercial temperature range.

Request a quote or submit a purchasing inquiry to receive pricing and availability for the LFE3-17EA-6FN484C.