LFE3-150EA-9FN1156I

The LFE3-150EA-9FN1156I is a member of the Lattice ECP3 FPGA family, offering a high-density, SRAM-based programmable logic fabric tailored for high‑performance digital processing and high-speed interface integration. The device combines 149,000 logic elements, extensive embedded memory and DSP resources with broad I/O and SERDES capability for demanding communications, video and networking applications.

Designed for industrial environments, this surface-mount device supports a 1.14 V–1.26 V core supply and an operating temperature range of −40 °C to 100 °C, making it suitable for systems that require robust performance across extended temperature ranges.

Key Features

• Logic Capacity — 149,000 logic elements provide significant on-chip programmable fabric for complex control, protocol handling and custom processing.
• Embedded Memory — Approximately 7.01 Mbits of on-chip RAM (total RAM bits: 7,014,400) for buffering, frame storage and local data tables.
• High-Speed DSP — Architecture derived from the ECP3 family with an enhanced sysDSP slice structure and support for numerous 18×18 multipliers (device family supports up to 320 18×18 multipliers) for efficient multiply-accumulate operations.
• SERDES & High-Speed I/O — Embedded SERDES capable of multi‑hundreds of Mbps to 3.2 Gbps data rates and support for a wide range of high-speed serial protocols; device offers up to 586 user I/Os for parallel and differential interfaces.
• Clocking & Timing — Flexible clock resources including up to ten PLLs and two DLLs to support diverse clocking and interface timing requirements.
• Flexible I/O Standards — Programmable I/O buffer support for many common standards and source-synchronous interfaces (features described for the ECP3 family).
• Configuration & System Support — Family features include dual-boot images, SPI boot flash interface and system-level utilities (as documented for the Lattice ECP3 family).
• Package & Mounting — 1156-BBGA package case; supplier device package listed as 1156-FPBGA (35 × 35 mm). Surface-mount device.
• Industrial Grade & Environmental — Grade: Industrial and RoHS compliant; rated for −40 °C to 100 °C operation.
• Power — Core voltage supply range: 1.14 V to 1.26 V.

Typical Applications

• Telecommunications & Networking — High-speed SERDES and abundant I/O make the device suitable for protocol bridging, packet processing and line cards that require multi‑Gbps serial links.
• Video & Broadcast Processing — Large logic and embedded memory capacity support video frame buffering, format conversion and SMPTE/serial video interface implementations.
• Industrial Automation & Control — Industrial temperature rating and flexible I/O enable motor control, sensor aggregation and protocol conversion in factory and process automation systems.
• High‑Performance Embedded Systems — DSP resources and plentiful logic elements are appropriate for custom compute acceleration, algorithm offload and real‑time signal processing.

Unique Advantages

• High integration density: 149,000 logic elements and substantial on‑chip RAM reduce external component count and simplify system architecture.
• Strong DSP capability: sysDSP slice architecture and support for up to 320 18×18 multipliers accelerate multiply-accumulate workloads without adding external DSP chips.
• Versatile high-speed connectivity: Embedded SERDES supporting up to 3.2 Gbps and 586 user I/Os enable multi‑protocol interfacing and high-throughput data paths.
• Industrial robustness: Industrial grade rating and −40 °C to 100 °C operating range allow deployment in temperature-challenged environments.
• Flexible configuration: Support for SPI boot flash and dual-boot device configuration facilitates field updates and secure image management.
• Compact, production-ready package: 1156-pin BGA/FPBGA footprint (35 × 35 mm) supports high I/O density while remaining suitable for surface-mount assembly.

Why Choose LFE3-150EA-9FN1156I?

The LFE3-150EA-9FN1156I brings a balance of high logic density, embedded memory and DSP acceleration in a single industrial-grade FPGA device. Its combination of up to 586 I/Os, high-speed SERDES capability and comprehensive clocking resources addresses complex interface and real-time processing needs without excessive external circuitry.

This device is well suited for design teams building communications equipment, video systems, industrial controls or embedded processing platforms that require scalable programmable logic, strong on‑chip memory and solid environmental tolerances—backed by the ECP3 family feature set and configuration options.

If you need pricing, lead time or a formal quote for LFE3-150EA-9FN1156I, submit a request to receive availability and purchasing information.