LFE3-150EA-9FN1156C

The LFE3-150EA-9FN1156C is an ECP3 family field programmable gate array (FPGA) from Lattice Semiconductor Corporation targeted at commercial electronic designs. It combines high logic capacity, substantial on-chip memory, and an extensive I/O complement in a compact 1156-ball BGA package.

With 149,000 logic elements, approximately 7.0 Mbits of embedded memory and 586 I/O pins, this device is suited for applications that require dense programmable logic, flexible I/O routing, and mid-range power rails in a surface-mount form factor.

Key Features

• Core Logic 149,000 logic elements provide large-scale programmable logic capacity for complex digital designs.
• Embedded Memory Approximately 7.0 Mbits of on-chip RAM to support buffering, state storage and logic-local data processing.
• High I/O Count 586 I/O pins enable extensive peripheral interfacing and multi-channel connectivity in a single device.
• Package & Mounting 1156-BBGA package (supplier device package: 1156-FPBGA, 35×35 mm) optimized for surface-mount board assembly and dense system integration.
• Power Operates from a supply range of 1.14 V to 1.26 V to match targeted system power rails.
• Operating Temperature & Grade Commercial grade device specified for 0°C to 85°C operation, suitable for standard commercial environments.
• Regulatory Compliance RoHS compliant for environmental and manufacturing compatibility.

Typical Applications

• High-density digital processing — Use the large logic capacity and embedded memory for signal processing, protocol implementation, and custom accelerators.
• Interface bridging and connectivity — High I/O count supports multiple parallel interfaces, protocol conversion, and system glue logic.
• Embedded system control — Integrate control logic, state machines, and peripherals in a compact, surface-mount BGA package for commercial products.
• Prototyping and evaluation — Suitable for development platforms where scalable logic capacity and plentiful I/O are needed for design iteration.

Unique Advantages

• Large programmable capacity: 149,000 logic elements enable implementation of sizeable logic functions without partitioning across multiple devices.
• Substantial on-chip memory: Approximately 7.0 Mbits of embedded RAM reduces external memory dependency and lowers board-level complexity.
• Extensive I/O integration: 586 I/O pins provide flexibility to connect numerous peripherals and interfaces directly to the FPGA.
• Compact, assembly-friendly package: 1156-BBGA in a 35×35 supplier footprint supports high-density board layouts and surface-mount manufacturing.
• Commercial temperature qualification: Rated 0°C to 85°C for reliable operation across standard commercial temperature ranges.
• RoHS compliant: Meets environmental compliance requirements for modern manufacturing processes.

Why Choose LFE3-150EA-9FN1156C?

The LFE3-150EA-9FN1156C positions itself as a high-capacity, commercial-grade FPGA that balances logic resources, embedded memory and I/O density in a single surface-mount package. Its combination of 149,000 logic elements, approximately 7.0 Mbits of RAM and 586 I/Os makes it suitable for designers seeking to consolidate complex digital functions and connectivity into a compact board footprint.

This device is well suited to commercial electronic designs that demand scalable programmable logic, robust on-chip memory and extensive interfacing, while maintaining compliance with RoHS and operating across standard commercial temperatures. It offers a practical option for teams focused on integrating significant logic and I/O capability without moving to larger multi-device solutions.

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