LFE3-150EA-9FN672C

The LFE3-150EA-9FN672C is an ECP3 family Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation. It combines high logic density, substantial on-chip memory, and a large I/O count in a surface-mount BGA package suitable for commercial applications.

With 149,000 logic elements, approximately 7.01 Mbits of embedded memory and 380 I/Os, this device targets designs that require dense programmable logic, flexible I/O connectivity and a compact package footprint while operating within standard commercial temperature and voltage ranges.

Key Features

• Logic Density  149,000 logic elements provide extensive programmable resources for complex digital designs and parallel processing implementations.
• Embedded Memory  Approximately 7.01 Mbits of on-chip RAM to support data buffering, state machines and intermediate storage without external memory.
• I/O Capacity  380 programmable I/Os enable broad peripheral and system interfacing for multi-protocol and multi-channel designs.
• Package and Mounting  672-BBGA package with supplier device package noted as 672-FPBGA (27x27); designed for surface-mount assembly to support compact PCB layouts.
• Power  Core voltage supply range of 1.14 V to 1.26 V allows integration into low-voltage system power domains.
• Operating Range and Grade  Commercial grade device with an operating temperature range of 0°C to 85°C and RoHS compliance for environmental compatibility.

Typical Applications

• Communications Infrastructure  Use the high logic density and large I/O count for protocol bridging, packet processing and custom interface logic in networking equipment.
• Video and Imaging  Embedded memory and abundant logic resources support buffering, format conversion and parallel pixel processing pipelines.
• Industrial Automation  Programmable I/Os and dense logic enable control, sensor aggregation and deterministic signal processing in commercial automation systems.
• Consumer and Embedded Systems  Compact BGA packaging and surface-mount design make this FPGA suitable for space-constrained consumer and embedded applications requiring flexible logic functions.

Unique Advantages

• High Logic Capacity: 149,000 logic elements allow implementation of complex digital functions and multiple concurrent logic blocks on a single device.
• Substantial On-Chip Memory: Approximately 7.01 Mbits of embedded RAM reduce reliance on external memory and simplify board-level BOMs.
• Large I/O Count: 380 I/Os provide flexibility for interfacing to many peripherals, sensors and high-pin-count subsystems without external multiplexing.
• Compact, Surface-Mount Package: 672-BBGA / 672-FPBGA (27x27) packaging supports dense PCB layouts and modern assembly processes.
• Low-Voltage Core: 1.14 V to 1.26 V supply range aligns with modern low-power system domains to aid power budgeting.
• Commercial Temperature and RoHS Compliance: Rated 0°C to 85°C and RoHS compliant, suitable for a wide range of commercial designs with regulatory environmental considerations.

Why Choose LFE3-150EA-9FN672C?

The LFE3-150EA-9FN672C positions itself as a high-density, commercially graded FPGA option for designers needing substantial logic, on-chip memory and flexible I/O in a compact BGA package. Its combination of 149,000 logic elements, approximately 7.01 Mbits of embedded RAM and 380 I/Os provides a balanced platform for complex digital designs where board space and integration matter.

This device is well suited to engineering teams building communication systems, video/imagery pipelines, embedded controllers and industrial automation equipment that require scalable programmable logic, robust interfacing and alignment with commercial temperature and RoHS requirements. It delivers long-term design value by consolidating functions on-chip to reduce BOM complexity and simplify system integration.

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