LFE3-150EA-8LFN1156I

The LFE3-150EA-8LFN1156I from Lattice Semiconductor Corporation is an ECP3-family field programmable gate array designed for industrial applications. It delivers a high logic density FPGA fabric with a large I/O count and embedded memory to support complex system integration and custom hardware acceleration.

Packaged in a 1156-ball BGA and specified for surface-mount assembly, this device targets designs that require substantial on-chip resources, broad interfacing capability, and operation across an extended industrial temperature range.

Key Features

• Logic Capacity — Provides 149,000 logic elements for implementing complex logic, state machines, and custom processing pipelines.
• Embedded Memory — Approximately 7.01 Mbits of embedded memory to support buffers, FIFOs, and on-chip data storage.
• I/O Count — 586 available I/O pins to enable extensive external interfacing and multi-channel connectivity.
• Power Supply — Operates from a 1.14 V to 1.26 V core supply range for compatibility with low-voltage systems.
• Package and Mounting — 1156-BBGA package (supplier device package: 1156-FPBGA, 35×35 mm) with surface-mount mounting for compact board integration.
• Industrial Temperature Range — Rated for operation from -40 °C to 100 °C for deployment in industrial environments.
• Standards Compliance — RoHS compliant, meeting common environmental and lead-free requirements.

Typical Applications

• Industrial Control Systems — Implement custom logic, deterministic I/O handling, and protocol bridging for factory automation and motion control.
• Communications Infrastructure — Support packet processing, protocol conversion, and interface aggregation with high I/O density.
• Video and Imaging — Provide parallel data processing and buffering using on-chip memory for camera interfaces and image pipelines.
• Embedded System Integration — Enable hardware acceleration and custom peripherals for OEM and embedded product designs.

Unique Advantages

• High Logic Density: 149,000 logic elements enable implementation of large, complex designs on a single device, reducing the need for multiple FPGAs or external glue logic.
• Significant On-Chip Memory: Approximately 7.01 Mbits of embedded memory provides local storage for buffering and state retention, minimizing external memory dependency.
• Extensive I/O Capability: 586 I/Os allow broad peripheral and sensor interfacing without additional expansion hardware.
• Industrial Temperature Support: Rated from -40 °C to 100 °C for reliable operation in demanding environments.
• Compact BGA Package: The 1156-ball BGA (1156-FPBGA, 35×35 mm) offers a dense, board-friendly footprint for space-constrained systems.
• RoHS Compliant: Meets environmental compliance requirements for modern manufacturing and assembly processes.

Why Choose LFE3-150EA-8LFN1156I?

The LFE3-150EA-8LFN1156I combines substantial logic capacity, meaningful on-chip memory, and a high I/O count in a compact BGA package, making it well suited for industrial-grade systems that demand integration and flexibility. Its operating voltage and temperature range are aligned with low-voltage, rugged embedded designs.

This device is appropriate for engineers and designers building complex control, communications, imaging, or embedded acceleration solutions who need a single-chip FPGA with the resources to consolidate functionality and simplify board-level BOMs.

Request a quote or submit your specifications to obtain pricing and availability for the LFE3-150EA-8LFN1156I. Our team can assist with lead times, volume pricing, and technical procurement details.